Electronics Forum | Fri Nov 02 12:01:26 EST 2001 | mparker
I have two cases where I must bake after DI wash. The moisture entrapment is specifically within microprocessor sockets. Without air gun blow out and baking, oxidation occurs that causes flaky contacts for the PGA. We will bake for 2-3 hours @ 60C. O
Electronics Forum | Wed Dec 03 07:30:57 EST 2008 | realchunks
Hi System Steve, What is a solvent cleaner over water wash? Solvent first and then rinse with water? And why do they feel the need to bake the boards? Do they think trapped moisture will cause board damage?
Electronics Forum | Tue Oct 30 21:42:32 EST 2001 | surachai
I have question about board baking after in line washing machine then I would like to know some information that ; 1) Do we need board baking after in line washing machine? Both bare board and assembly borad normally we don't bake . 2)In case of ne
Electronics Forum | Tue Jan 06 14:37:27 EST 2009 | stevek
The easiest way to prove out the absorbtion theory is to weigh the parts before wash, after wash, and after baking. You probably want to do this with the bare parts in isolation as the fab will pick up considerable moisture. Differences in weight s
Electronics Forum | Thu Dec 11 11:59:23 EST 2008 | joeherz
Update - We've tested a board previously having voiding issues with ENIG versions and the voiding has completely disappeared. No other variables were changed. Looks promising. I have an order of LF HASL boards arriving soon that we plan to split i
Electronics Forum | Thu Nov 01 00:32:14 EST 2001 | ianchan
we bake boards 80~120 deg-C @1hr, after in-line DI wash. oven setting to 90 deg-C, as +/-5 deg-C, tolerance against door open/shut fluctuations = "temperature loss". If anyone has evidenced procedure, that shows no need for baking, pray do share wi
Electronics Forum | Thu May 18 03:15:32 EDT 2017 | wama
We are soldering wire 26AWG to jack socket. However after went through washing, baking, coating, curing processes the wire breaks (at joining point with jack socket) during wire dressing. We have tried to increase and decrease the solder amount but r
Electronics Forum | Mon Dec 29 09:10:22 EST 2008 | stepheniii
It takes time for the moisture to penetrate into the body. I think the 5 years of ambient would be more the culprit than washing the boards. Especially since you are baking them after wash. Get a few of the ICs and put them loose on a board and put
Electronics Forum | Fri Jan 05 20:12:22 EST 2007 | engr
I am using PWB material Rogers 6002 High Frequency Laminate. The PWBs are assembled. They were washed and will require a bake out. Some people say, no bake out is required for the material. I am getting different reads in test if the CCAs are not
Electronics Forum | Tue Dec 02 18:10:39 EST 2008 | sys_steven
Need your opinion guys.. The old timers at the plant here feel that we should clean our board after Misprints withe the solvent cleaner over water wash. This is so they don't have to rebake the pcb for 24 hours before smt again. I don't believe th
