Full Site - : wash bake (Page 5 of 16)

PCB Baking after Wash

Electronics Forum | Mon Dec 08 18:25:35 EST 2008 | yuepingwu

Hi Bob, Do you have information about IPC D-35 for reference? What moisture sensitive level is the Sn-Pb/RoHS of PWB? Does PWB supplier start to implement PWB drying packaging?

PCB Baking after Wash

Electronics Forum | Thu Dec 04 00:22:11 EST 2008 | maacolomer

Hi Steven, The 24 hrs bake is an overkill according with various J-STDs. Assuming a bake temperature over the 100 Celsius degrees. There are several factors to be considered before deciding the best methodology to wash misprinted board. However,

PCB Baking after Wash

Electronics Forum | Tue Dec 09 10:04:36 EST 2008 | lazzara55

SMT-ypw: Does PWB supplier start to implement PWB drying packaging? B3: YES! The fabrication of the PCB involves a series of wet processing that requires counter-measures to remove moisure. While some of the PCB processes also include bake cycles th

SMT voiding

Electronics Forum | Mon Sep 17 14:45:57 EDT 2012 | kkay

We are experiencing voiding on one of our lead-free assemblies on every part. The voiding only occurs underneath the parts and not in the solder fillet (see pic). We have tried baking, curing, washing, multiple pastes and everything else we can think

BAKING MICRO BGA BOARDS AFTER REFLOW AND WASH

Electronics Forum | Mon Apr 12 11:43:11 EDT 2004 | wgaffubar

Your wash unit should dry the boards well enough for you just take them and run them second pass within minutes of exiting the wash unit. We did it for years with no problem at all. If you must the hour at 125 will dry the wash water more than enough

Water in TH cap sleeves

Electronics Forum | Wed Nov 26 19:10:05 EST 2014 | caurbach

While I can't directly answer your question, we've had the same problem here occasionally. Our wash parameters are roughly the same as yours. It seems to be correlated to the diameter of the cap (larger caps will balloon while most smaller caps are

BAKING MICRO BGA BOARDS AFTER REFLOW AND WASH

Electronics Forum | Tue Mar 30 22:30:06 EST 2004 | davef

Tony First, drying at 125*C for an hour is not going to do much drying. Heck, those boards are barely warm to the touch. Second, tell us about: * Pitch of your uBGA * Solder paste flux * Cleaning process and agents

Water Residue Stains - how to remove?

Electronics Forum | Wed Dec 19 02:24:40 EST 2001 | ianchan

Did I mention, we tried to use the same WS flux formulae to brush-cover the affected flex-PCB pads, and subject it to another round of water-wash, followed by oven-baking, and it still doesn't help abit? Oven bake : 100 deg-C, approx 15~30mins (manu

Exsessive assembly cleaning

Electronics Forum | Fri Jun 09 09:52:03 EDT 2023 | tommy_magyar

I agree with Mainteneer on this. Depending on the active components, I would check the datasheets of them. Particular groups of components to pay attention to: microphones, microprocessors, transformers, relays, switches. Washing may be in some cases

Water Washing

Electronics Forum | Mon Dec 21 12:20:52 EST 2009 | MLD

Here is my question to the Guru's on this site. Lead free boards to go though Wave / reflow - and then sent through a water wash 2 day's prior to Hand assembling a 50mil ribbon connector. This is a 4 layer board with 2x2116 pre-preg (.036 1/1 5x762


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