Industry News | 2016-04-20 17:14:24.0
KYZEN will present during ACI Technologies’ Third Annual Tech Expo, scheduled to take place April 27-28th at its facility in Philadelphia, Pa. Debbie Carboni will present “Unwashed circuit boards are more likely to fail, why use soap?”
Industry News | 2020-10-03 09:09:40.0
Austin American Technology (AAT) is pleased toannounce that it received a 2020 GLOBAL Technology Award in the category of Cleaning Equipment for its Mega ION®. The award was announced during a Virtual Awards Ceremony on Tuesday, September 29, 2020.
Industry News | 2021-12-03 20:03:25.0
Differential pressure transmitter is a kind of pressure measuring instrument widely used in all kinds of chemical industry. Working principle of differential pressure transmitter is as follows. The differential pressure from the two-sided pressure pipes acts directly on the two-sided isolation diaphragm of the differential pressure transmitter sensor, and is transmitted to the measuring element through the sealing fluid in the diaphragm. The measuring element converts the measured differential pressure signal into the corresponding electrical signal and transmits it to the converter. After amplification and other processing, it becomes the standard electrical signal and then is output.
Industry News | 2018-07-26 19:32:36.0
series, an AOI system providing optical inspection capabilities for through-hole technology (THT) components of electronic boards, as well conformal coating (CC), increasingly used today to protect the products after manufacturing.
Industry News | 2019-05-16 01:27:23.0
There are several surface treatment for PCB board: bare board (no treatment on the surface), rosin board, OSP (Organic Solderability Preservatives), HASL (lead tin, lead-free tin), plating gold, immersion gold, etc., these are relatively conscious treatment. Many people can't tell the difference between plating gold and immersion gold, thinking that it is the same thing, it is a big mistake. The following is a brief introduction to the difference between plating gold and immersion gold.
Industry News | 2008-04-07 23:18:22.0
MORRISVILLE, NC - March 31, 2008 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that its OPASS technology won a NPI Award in the Software category. The award was presented to the company during a Monday, March 31, 2008 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2008. OPASS, which stands for Offset Placement After Solder Screen Printing, was developed to address the problem of solder paste alignment errors.
Industry News | 2008-04-08 22:36:16.0
MORRISVILLE, NC - April 2, 2008 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces it was named as a first finalist for its OPASS technology in the Design and Manufacturing Software category during the VISION Awards announcement ceremony that took place Wednesday, April 2, 2008 in Las Vegas during APEX 2008. OPASS, which stands for Offset Placement After Solder Screen Printing, was developed to address the problem of solder paste alignment errors.
Industry News | 2008-04-08 23:53:03.0
MORRISVILLE, NC - April 2008 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that it won a 2008 SMT China Vision Award for its OPASS technology in the Software - Production category during an awards ceremony that took place April 8, 2008 at the Shanghai Everbright Convention & Exhibition International Hotel during NEPCON China/EMT China. OPASS, which stands for Offset Placement After Solder Screen Printing, was developed to address the problem of solder paste alignment errors.
Industry News | 2010-05-07 15:45:06.0
Substantial increase in sales and profits in the first quarter.
Industry News | 2016-09-23 15:41:59.0
Akrometrix today announced that Ryan Curry, Technical Account Manager, will co-present a paper with Don Adams, Manufacturing Engineering Manager at Bose Corporation, during SMTA International. The presentation, “Understanding PCB Design and Material Warpage Challenges Which Occur during B2B/Module-Carrier Attachment,” is scheduled to take place during session APT7, “Package and PCB Interactions,” on Wednesday, September 28th at 4 p.m.
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