Industry Directory | Consultant / Service Provider / Manufacturer
Trusted EMS Manufacturer, ISO9001, ISO14001, UL, RoHS, REACH Cheap PCB Assembly, No MOQ, Min Device 01005 HDI PCB from 4-20 Layers, Anylayer Build-up, BGA 0.25mm Quickturn Delivery Supported by 3 Plants
Industry News | 2013-08-26 20:46:25.0
SEHO Systems GmbH introduces an AOI system for optical inspection of THT assemblies that has been developed in cooperation with partner company IVT Industrial Vision Technologies GmbH.
New Equipment | Cleaning Equipment
SMT Fixture Cleaning Machine SME-5200 Cleaning basket size Φ1000mm x H 200mm Clean tank capacity 80L Dry time 10~20Min Machine weight 500KG Product description: SMT Fixture Cleaning Machine SME-5200, Cleaning basket size Φ1000mm x H 2
New Equipment | Cleaning Equipment
SMT Fixture Cleaning Machine SME-5200 Cleaning basket size Φ1000mm x H 200mm Clean tank capacity 80L Dry time 10~20Min Machine weight 500KG Product description: SMT Fixture Cleaning Machine SME-5200, Cleaning basket size Φ1000mm x H 2
PCBA , Printed Circuit Board Assembly, PCB Assembly , EMS pcba, Electronic Manufacturing OEM PCBA Tronixlink PCB Assembly line includes the latest process in SMT and wave soldering along with SIP, AOI, X-ray, ICT and functional testing. Our SMT capab
SMT Fixture Cleaning Machine SME-5200 Cleaning basket size Φ1000mm x H 200mm Clean tank capacity 80L Dry time 10~20Min Machine weight 500KG Product description: SMT Fixture Cleaning Machine SME-5200, Cleaning basket size Φ1000mm x H 200
New Equipment | Cleaning Equipment
SMT Fixture Cleaning Machine SME-5200 Cleaning basket size φ1000mm x H 200mm Clean tank capacity 80L Dry time 10~20Min Machine weight 500KG Product description: SMT Fixture Cleaning Machine SME-5200, Cleaning basket size φ1000mm x H 200mm, Cle
Solder joint inspection of bottom-side PCBs Intelligent Inspection of Solder Joints, THT and SMD Components Today, the industry standard quality assurance in electronics production is automatic optical inspection (AOI) of SMD components on printed
Technical Library | 2017-10-16 15:03:32.0
The miniaturization and advancement of electronic devices have been the driving force of design, research and development, and manufacturing in the electronic industry. However, there are some issues occurred associated with the miniaturization, for examples, warpage and reliability issues. In order to resolve these issues, a lot of research and development have been conducted in the industry and university with the target of moderate melting temperature solder alloys such as m.p. 280°C. These moderate temperature alloys have not resolve these issues yet due to the various limitations. YINCAE has been working on research and development of the materials with lower temperature soldering for higher temperature application. To meet this demand, YINCAE has developed solder joint encapsulant paste to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. This solder joint encapsulant paste can be used in typical lead-free profile and after reflow the application temperature can be up to over 300C, therefore it also eliminates red glue for double side reflow process. In this paper, we will discuss the reliability such as strength of solder joints, drop test performance and thermal cycling performance using this solder joint encapsulant paste in detail.
A dealer of high quality Used SMT Equipment, Used Plastic Injection Molding Equipment, Used Machine Tools, Used Semiconductor Machinery, and Used Industrial Machinery.
Equipment Dealer / Broker / Auctions
104 East Street
Middleton, MA USA
Phone: 978 790-2774
