Electronics Forum | Wed Jan 14 06:42:38 EST 2004 | tommy
We see spattered(spitting of flux or solder to nearby area) solder/flux on gold fingers.We view the gold fingers area under 30x before reflow and it is cleaned but after reflow we see flux droplets or solder on gold fingers. We tried to changed a new
Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow
Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect
Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow
Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect
Electronics Forum | Thu Sep 06 10:34:21 EDT 2001 | Mike Konrad
Hi Jeff, Sean is correct. Although ultrasonic technology will work in post-reflow de-fluxing applications, you will receive concerns regarding ultrasonic �damage� to wire bonded components. Much has been written to combat this belief but the conce
Electronics Forum | Wed Feb 14 16:58:12 EST 2018 | cbart
you would be best to get this from your paste/solder manufacture. but here are some rules of thumb: -Solder paste out of fridge before use - get out the night before needed.. don't let your op's warm on the oven!! you will regret that! if not over ni
Electronics Forum | Thu Jun 27 13:33:21 EDT 2019 | duchoang
Wash the board or do what ever to get rid of flux /flux residue at the parts before running second side. If you can, use special reflow profile for the second side ( Less heat for bottom side).
Electronics Forum | Thu Aug 24 08:59:38 EDT 2000 | Eugene Smelik
Dr. Lee, For Pb-free solders, will the reflow profile be similar to that of Sn/Pb, with an flux activation plateau before going to peak reflow, or will the profile be more linear in nature? Are there advantages/disadvantages to either profile for P
Electronics Forum | Tue Aug 30 12:08:09 EDT 2005 | slthomas
The answer for us at my previous employer was water soluble flux. Wash the board, no residue. If you're not set up to wash (needing a washer, DI water source, waste treatment, ventilation, etc.) it can be expensive and space consuming. Do some resea
Electronics Forum | Wed Feb 26 23:59:48 EST 2003 | Mike Konrad
Grant, No-Clean paste + IPA = White Residue! #1: Stop using IPA #2: Switch to either a solvent-based de-fluxing chemical or an aqueous-based de-fluxing chemical. If you are using an ultrasonic cleaner for your boards as stated, do not use sapon
Electronics Forum | Thu Aug 24 15:37:50 EDT 2006 | Chunks
Hi Any, This is from an earlies thread "Solder Ball After Reflow Process". Date: August 16, 2006 01:52 PM Author: Russ Subject: Solder Ball After Reflow Process Oven settings are meaningless here. What does the board see? It is the paste we a
