Industry News | 2008-02-29 17:36:35.0
RANCHO CUCAMONGA, CA � January 2008 � Aqueous Technologies Corp. announces that it will highlight the Trident, its fourth-generation automatic defluxing system, and Trident II in booth 2431 at the upcoming APEX 2008 exhibition and conference scheduled to take place April 1-3, 2008 in Las Vegas.
New Equipment | Board Handling - Storage
Prevent your components from micro-cracking during reflow with proper Ultra-Low Humidity Storage. DXU models of maintain1%RH Wide range of cabinets including UL/C models Conforms to IPC/JEDEC J-STD 033B.1 Dehumidifies ICs to prevent micro-crack
Industry News | 2010-05-07 15:09:12.0
RANCHO CUCAMONGA, CA — Aqueous Technologies Corp., North America’s largest provider of batch defluxing systems, announces that it sold a Trident III automatic defluxing and cleanliness testing system to Advance Circuit Technology of Rochester, NY. The Trident Series represents the next generation of lead-free compatible, fully automatic post-reflow defluxing systems.
New Equipment | Solder Materials
Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for
Industry News | 2007-10-04 16:52:51.0
RANCHO CUCAMONGA, CA � September 24, 2007 � Aqueous Technologies Corp. announces the release of Trident, its fourth-generation automatic defluxing system. The Trident Series represents the next generation of lead-free compatible, fully automatic post-reflow defluxing systems.
Industry News | 2007-10-22 17:05:46.0
RANCHO CUCAMONGA, CA � October 22, 2007 � Aqueous Technologies Corp. announces that it will premier the Trident, its fourth-generation automatic defluxing system, in booth 1019 at the upcoming Assembly New England/Nepcon East exhibition and conference scheduled to take place October 30-31, 2007 at the Boston Convention & Exhibit Center. The Trident Series represents the next generation of lead-free compatible, fully automatic post-reflow defluxing systems.
Technical Library | 2021-09-29 13:35:21.0
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations. Selective soldering using dedicated plates with nozzles on the solder area is the preferred way to make these connections. All joints can be soldered in one dip resulting in short cycle times. Additional soldering on a small select nozzle can make the system even more flexible. The soldering can only be successful when there is enough thermal heat in the assembly before the solder touches the board. A forced convection preheat is a must for many applications to bring enough heat into the metal and board materials. The challenge in a dip soldering process is to get a sufficient hole fill without bridging and minimize the number of solder balls. A new cover was designed to improve the nitrogen environment. Reducing oxygen levels benefits the wetting, but increases the risk for solder balling. Previous investigations showed that solder balling can be minimized by selecting proper materials for solder resist and flux.
(Albany, NY) 1/2/2018 – YINCAE Advanced Materials has recently developed a reflowable (no flow) underfill: SMT 160. This product is designed to eliminate capillary underfills, simplify the assembly process, combine soldering and underfilling in SMT p
Industry News | 2007-10-30 16:20:49.0
RANCHO CUCAMONGA, CA � October 30, 2007 � Aqueous Technologies Corp. announces that it will introduce the Trident, its fourth-generation automatic defluxing system, in Area A4, Booth 434 at the upcoming Productronica 2007 exhibition and conference scheduled to take place November 13-16, 2007 at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2008-04-08 22:28:09.0
RANCHO CUCAMONGA, CA � April 2, 2008 � Aqueous Technologies Corp. announces that Trident, its fourth-generation automatic defluxing system, was named as a first finalist in both the Cleaning Systems and Environmentally Friendly Products/Services categories during the VISION Awards announcement ceremony that took place Wednesday, April 2, 2008 in Las Vegas during APEX 2008.
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