Industry News | 2009-12-17 18:14:12.0
Minneapolis, MN - The SMTA and Chip Scale Review magazine are pleased to announce the Best of Conference Paper from the 6th Annual International Wafer-Level Packaging Conference and Exhibition, which was held October 27-30, 2009 at the Marriott Hotel in Santa Clara, California. After review by members of the 2009 IWLPC Technical Committee, In-Soo Kang (NEPES Corporation) has been selected as the Best of Conference award winner for his technical paper on "Development of Wafer Level Package of Normal and High Pin Count Devices for Mobile Applications."
Industry News | 2010-10-20 21:21:00.0
The SMTA and Chip Scale Review magazine are pleased to announce the 7th Annual International Wafer-Level Packaging Conference and Exhibition was a resounding success. The IWLPC was held October 11-14, 2010 at the Santa Clara Marriott Hotel in Santa Clara, California.
Industry News | 2011-11-08 15:31:27.0
The SMTA and Chip Scale Review magazine are pleased to announce the 8th Annual International Wafer-Level Packaging Conference and Exhibition was a resounding success.
Industry News | 2016-05-16 20:37:54.0
The competition was fierce as a new record of 43 competitors competed at IPC’s Hand Soldering Competition at SMT Hybrid Packaging 2016 in Nuremberg, Germany. Taking first place and a cash prize of €300 was Ekatarina Stahlmann of Grundig Business Syst., who earned 495 points out of 506.
Industry News | 2017-06-07 11:59:39.0
The competition was fierce as 34 competitors participated in the IPC’s Hand Soldering Competition at SMT Hybrid Packaging 2017 in Nuremberg, Germany. Taking first place and a cash prize of €300 was Elaine Chesnais, Thales International, who earned 433 points out of a possible 437. Chesnais was the second-place winner at SMT in 2016.
Industry News | 2018-06-17 16:35:01.0
The competition was fierce as 27 competitors went soldering iron to soldering iron in IPC’s Hand Soldering Regional Qualification Competition at SMT Hybrid Packaging 2018 in Nuremberg, Germany. Of the 27 boards submitted by the competitors only four of the electronic assemblies were functional. Taking first place and a cash prize of €300 was Catherine Cardinal-Simoan, Thales International, who earned 422 points out of a possible 445.
Parts & Supplies | Assembly Accessories
Detailed Product Description Part Name: LNC60 I/F Cable ASM Part Number: 40070445 Machine: JUKI KE2070 2080 FX3 Machine Condition: Original New Brand: JUKI Application: For LNC60 Laser 40070445 LNC60 I/F Cable ASM(2012) For JUKI 2070 2080 FX3 Mac
Industry News | 2013-05-01 12:45:51.0
Held at the Rijckholt Castle and Nordson ASYMTEK European Headquarters in Maastricht
Industry News | 2013-11-05 23:02:54.0
Nordson ASYMTEK will introduce the Spectrum™ II at Productronica this year, marking the 6-year anniversary of the introduction of the Spectrum series of high-speed, high-accuracy dispensing platforms. The Spectrum II S2-900 Series leverages the same small footprint of 600mm x 1321mm as the original Spectrum to provide maximum productivity with minimum manufacturing floor space, but improves the precision, accuracy, and speed of the system to rival much larger platforms.
Industry News | 2014-02-13 23:58:33.0
Nordson ASYMTEK introduces the Quantum™ Q-6800 high-performance, large-format dispensing system for SMT, PCB packaging, and microelectronics assembly applications. Quantum’s dispense area of 423 x 458 mm handles a wide range of substrate sizes and is large enough so the dispense area isn’t compromised even with dual valve configurations, enabling flexibility in the dispensing process.
