Industry Directory: water flux under bga (2)

Shenmao Technology Inc.

Industry Directory | Manufacturer

SHENMAO Technology, Inc. supplier of Pb/Pb-free Solder Pastes, Solder Wire, Solder Bar, Flux, BGA Sphere, Bumping Paste/Flux, PCB Plating Anode, PV Ribbon Electronics Assembly Materials, for over 44 years from 10 world locations.

Precision Assembly

Industry Directory | Manufacturer

Precision Assembly Inc. offers the most Innovative Electronics Contract Manufacturing Services and Solutions (ECMSS) to meet the needs of our customers. Our highly skilled teams have the manufacturing expertise required to meet your needs

New SMT Equipment: water flux under bga (44)

APR Solder Paste Dipping Plate

APR Solder Paste Dipping Plate

New Equipment | Solder Paste Stencils

These fixture plates facilitate the controlled dipping of flux or paste onto the balls under the BGA packages. Flux or paste is controlled at a depth of 50-60% per cent of the ball diameter prior to placement of a BGA or to place a PoP component on t

BEST Inc.

Solder Paste Dipping Plate

Solder Paste Dipping Plate

New Equipment | Solder Paste Stencils

These fixture plates facilitate the controlled dipping of flux or paste onto the balls under the BGA packages. Flux or paste is controlled at a depth of 50-60% per cent of the ball diameter prior to placement of a BGA or to place a PoP component on t

BEST Inc.

Electronics Forum: water flux under bga (298)

Crystalized Flux under BGA

Electronics Forum | Wed Aug 04 16:46:40 EDT 2004 | davef

We assume this is different discussion that the discussion about "crystallized flux under BGA". Correct? Milky residue with water washing makes us think "noclean flux res that just got washed". We know what you said, but we can't help ourselves.

Crystalized Flux under BGA

Electronics Forum | Tue Aug 03 18:11:21 EDT 2004 | davef

Improper washing of water soluable flux residues can be a major contributor to flux residues remaining on the board surface. ;-O That you appear to be only complaining about the pathetic state of the ability of your washer to clean under BGA, it may

Used SMT Equipment: water flux under bga (2)

Hexi wave soldering machine

Hexi wave soldering machine

Used SMT Equipment | Soldering Equipment/Fluxes

Features: Windows XP operation software with Chinese and English alternative available. whole system under integration control can analyze and display the failure. All production data can be saved completely and analyzed. PC& Siemens PLC cont

V-soltes Electronic Equipment Co.,Ltd

Torch A8N

Torch A8N

Used SMT Equipment | Soldering - Reflow

A8N Main electric part uses international brand components. Temperature control design achieves international advanced level with stable and even temperature. It is suitable for soldering CSP, BGA component. Energy-saving inner oven design and heat

Beijing Torch Co.,Ltd

Industry News: water flux under bga (166)

IPC and SMTA Announce Schedule for Session 4 of the High Performance Cleaning and Coating Conference

Industry News | 2010-10-11 14:57:11.0

Industry-leading associations IPC and SMTA jointly announce the agenda for Session 4 of the High Performance Cleaning and Coating Conference, scheduled to take place November 16-18, 2010 at the Renaissance Hotel & Convention Center in Schaumburg, Illinois.

Association Connecting Electronics Industries (IPC)

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

Technical Library: water flux under bga (3)

Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer

Technical Library | 2024-02-02 07:48:31.0

Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer In today's rapidly evolving electronics manufacturing landscape, optimizing efficiency, cost-effectiveness, and precision remains paramount. Businesses engaged in producing industrial control boards, computer motherboards, mobile phone motherboards, and mining machine boards face ongoing challenges in streamlining production processes. The integration of expensive equipment strains budgets, making the creation of an efficient, cost-effective high-speed SMT line a daunting task. However, a solution exists that seamlessly combines these elements into a singular, high-performance, and cost-effective SMT line. Let's delve into the specifics. A Comprehensive High-Speed SMT Line Our innovative solution amalgamates two pivotal components: a cutting-edge SMT (Surface Mount Technology) production line and a laser cutting line equipped with a depanelizer. The SMT Production Line The high-speed SMT line comprises several essential components, each fulfilling a unique role in the manufacturing process: 1. PCB Loader: This initial stage involves loading boards onto the production line with utmost care. Our Board Loader prioritizes safety, incorporating various safety light curtains and sensors to promptly halt operations and issue alerts in case of any anomalies. 2. Laser Marking Machine: Every PCB receives a unique two-dimensional code or barcode, facilitating comprehensive traceability. Despite the high-temperature laser process potentially leading to dust accumulation on PCB surfaces, our dedicated PCB Surface Cleaner swiftly addresses this issue. 3. SMT Solder Paste Printer: This stage involves applying solder paste to the boards, a fundamental step in the manufacturing process. 4. SPI (Solder Paste Inspection): Meticulous inspections are conducted at this stage. Boards passing inspection proceed through the NG (No Good) Buffer Conveyor to the module mounters. Conversely, "No Good" results prompt storage of PCBs in the NG Buffer Conveyor, capable of accommodating up to 25 PCBs. Operators can retrieve these NG boards for rework after utilizing our specialized PCB Mis Cleaner to remove solder paste. 5. Module Mounters: These machines excel in attaching small and delicate components, necessitating precision and expertise in the module mounting process. 6. Standard Pick And Place Machines: The selection of these machines is contingent upon your specific BOM (Bill of Materials) list. 7. Pre-Reflow AOI (Automated Optical Inspection): Boards undergo examination for component quality at this stage. Detected issues prompt the Sorting Conveyor to segregate boards for rework. 8. Reflow Oven: Boards undergo reflow soldering, with our Lyra series reflow ovens recommended for their outstanding features, including nitrogen capability, flux recycling, and water cooling function, ensuring impeccable soldering results. 9. Post-Reflow AOI: This stage focuses on examining soldering quality. Detected defects prompt the Sorting Conveyor to segregate boards for further inspection or rework. Any identified defects are efficiently addressed with the BGA rework station, maintaining the highest quality standards. 10. Laser Depanelizer: Boards advance to the laser depanelizer, where precision laser cutting, often employing green light for optimal results, ensures smoke-free, highly accurate separation of boards. 11. PCB Placement Machine: Cut boards are subsequently managed by the PCB Placement Machine, arranging them as required. With this, all high-speed SMT line processes are concluded. Efficiency And Output This production line demonstrates exceptional productivity when manufacturing motherboards with approximately 3000 electronic components, boasting the potential to assemble up to 180 boards within a single hour. Such efficiency not only enhances output but also ensures cost-effectiveness and precision in your manufacturing processes. At I.C.T, we specialize in crafting customized SMT production line solutions tailored to your product and specific requirements. Our equipment complies with European safety standards and holds CE certificates. For inquiries or to explore our exemplary post-sales support, do not hesitate to contact us. The I.C.T team is here to elevate your electronics manufacturing to new heights of efficiency and cost-effectiveness.

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Effect of BGA Reballing and its Influence on Ball Shear Strength

Technical Library | 2013-07-11 15:22:40.0

This research paper will focus on the effect of various parameters that are used to reball a BGA and their effect on the overall shear strength. Factors that will be looked at include the type of BGA (SAC305 or 63Sn/37Pb), the alloy used to reball (SAC405 or 63Sn/37Pb), the type of flux used (Water Soluble or No Clean), and the environment in which reballing takes place (Nitrogen or Ambient).

MARTIN (a Finetech company)

Videos: water flux under bga (14)

How to reduce solder joint voids from 30% to 1%? Try I.C.T Vacuum Reflow Oven

How to reduce solder joint voids from 30% to 1%? Try I.C.T Vacuum Reflow Oven

Videos

  · What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine?    · What problems can be solved by smt vacuum reflow soldering machine?   · What is the basic principle of vacuum reflow machine?   · Ho

Dongguan Intercontinental Technology Co., Ltd.

Electrovert Cleaning

Electrovert Cleaning

Videos

The Electrovert Aquastorm is a versatile, high performance cleaning system designed to optimize the PCB cleaning process while minimizing overall cost.  The Aquastorm features the most advanced cleaning technologies in an energy-efficient design

ITW EAE

Events Calendar: water flux under bga (2)

Rework Symposium

Events Calendar | Tue Mar 07 08:00:00 EST 2017 - Tue Mar 07 14:00:00 EST 2017 | Rolling Meadows, Illinois USA

Rework Symposium

BEST Inc.

Kester to Host Technical Rework Seminar

Events Calendar | Wed May 10 00:00:00 EDT 2017 - Wed May 10 00:00:00 EDT 2017 | Itasca, Illinois USA

Kester to Host Technical Rework Seminar

Kester

Career Center - Resumes: water flux under bga (1)

Printed Circuit Assembly Production/Process Engineer

Career Center | tulsa, Oklahoma | Engineering

Printed Circuit Assembly Process Engineer. Seeking a position in a high-technology operation, utilizing my background supporting a progressive and growth-oriented organization. Offering the technical experience, expertise, and skills gained during th

Express Newsletter: water flux under bga (737)

Partner Websites: water flux under bga (74)

FluxPlus™ Paste Flux | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/efd-products/fluxplus-paste-flux

... Zoom in on Image FluxPlus Paste Flux Formulated to work with any alloy and heating process, Nordson EFD’s FluxPlus™ is perfect for BGA rework, mobile device repair, reflowing solder paste, and more

ASYMTEK Products | Nordson Electronics Solutions

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf

placed in the Electrovert Aquastorm 200 in-line cleaning system for removal of solder flux residues and other contaminants from the assembly. The in-line cleaner utilized 13.5% (by volume) Kyzen Aquanox 4625 saponifier in deionized water. The in-line

Heller Industries Inc.


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Circuit Board, PCB Assembly & electronics manufacturing service provider

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