Electronics Forum | Mon Feb 22 16:39:33 EST 1999 | C.K.
| | Hi Folks. Has any Process Engineer here done a complete evaluation or controlled experiment for VOC-FREE Flux? Our goal here at CEBUKid, Inc. is to implement a VOC-FREE process. We have all the necessary (OPTIFLUX) spray equipment, and we're c
Electronics Forum | Thu Oct 18 11:59:38 EDT 2012 | jackofallmasterofnone
1) At this time we do not have a design engineer. I have contacted the PCB manufacturer about changing the drill file to close up the diameter on the holes a bit. This should allow the wings on the leads of the component to rest on top of the holes i
Electronics Forum | Tue Jun 08 17:52:53 EDT 1999 | Chrys Shea
| | | Hi,my master | | | How to iron out such soldering bridge with below conditions: | | | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | | | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | | | 3.using s
Electronics Forum | Thu Jan 14 15:10:14 EST 1999 | Earl Moon
| | Hi Folks. Has any Process Engineer here done a complete evaluation or controlled experiment for VOC-FREE Flux? Our goal here at CEBUKid, Inc. is to implement a VOC-FREE process. We have all the necessary (OPTIFLUX) spray equipment, and we're c
Electronics Forum | Mon Jan 28 08:07:44 EST 2002 | JohnW
Sorry I keep forgetting you lot are backwards in the old metric system :0) anyhoo, yes IPC, the bastions of right well as long as your board is only 1.6mm thick (sorry 62mils)say that you need 75% min general and 50% on ground planes. I'd like to se
Electronics Forum | Thu Jun 03 14:40:22 EDT 1999 | JohnW
| | | | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. W
Electronics Forum | Thu Jun 03 14:41:06 EDT 1999 | JohnW
| | | | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. W
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Career Center | Sugar land, Texas USA | Engineering,Maintenance,Management,Production,Purchasing,Sales/Marketing,Technical Support
Production Management, SMT, Manufacturing Engineering, Programming, CircuitCam, Inventory Control, AOI, Fuji AIM/ NXT, Assembleon, Universal, Quad, Mydata, Heller, DEK, Mirtec, Aqueous Tech, MPM, Resys, Vapor Phase, Juki, Selective Soldering, HMP, El
