Solder Paste Inspection Technologies: 2D-3D Correlation Solder Paste Inspection Technologies: 2D-3D Correlation It is understood that the solder paste printing process presents far more opportunities for defects than any of the other individual
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
Nanomaterial Surface Finishes for Assembly of Printed Circuit Boards for High Reliability Applications Gregory Morose, et al. Abstract 22-4 ELECTROLESS Ni/Pd/Au PLATING FOR PACKAGE SUBSTRATES WITH FINE PITCH WIRING Yoshinori Ejiri, et al. Abstract 22-4 ACHIEVING
| http://etasmt.com/te_news_bulletin/2020-10-17/19961.chtml
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