Electronics Forum | Fri Oct 14 09:58:13 EDT 2005 | patrickbruneel
Here's what I believe is happening. The main difference between the HASL boards and the gold plated boards is that HASL boards are pre-soldered. HASL boards need very little flux activity to get good hole fill and the machine settings have a wide pro
Industry News | 2018-10-18 10:13:08.0
The Application of the Pin-in-Paste Reflow Process
Industry News | 2015-01-21 20:14:04.0
Sono-Tek Corporation (OTC BB: SOTK) will highlight the newest improvement to the SonoFlux ultrasonic spray fluxer design, the QR Impact Jet in Booth #3521 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. The Impact atomizing assembly is used in both the Sono-Flux Servo and Sono-Flux EZ system and incorporates an air deflector that drives the flux droplets to the PCB for maximum top side fill and unsurpassed through-hole penetration.
SMTnet Express, May 12, 2022, Subscribers: 25,588, Companies: 11,569, Users: 27,213 Electronics Manufacturing Technical Articles Filling of Microvias and Through Holes by Electrolytic Copper Plating –Current Status and Future
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Stencil Design for Mixed Technology Through-hole / SMT Placement and Reflow by William E. Coleman, Photo
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/about-us/nordson-blog/electronics-solutions-blogs/selective-vs-wave-soldering
. The major downside of wave soldering is the limited ability to define process parameters, which leads to poor solder joint quality and diminished product reliability
| https://www.smtfactory.com/What-is-the-working-process-of-Full-auto-SMT-Stencil-Printer-id40272477.html
⑧ The stencil is aligned with the PCB, the Z-frame will move upward, and the PCB touches the lower part of the stencil ⑨ Once moved into place, the squeegee will push the solder paste to roll on the stencil and print it on the PCB's PAD position through the holes in the stencil. ⑩ When the
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