Electronics Forum | Tue Dec 16 06:42:51 EST 2003 | Kev
I am having problems achieving correct pre-heater temperatures with our Hollis solder wave. Our original "Verification Golden board" program uses a conveyor speed of 5ft per minute and pre-heat temps of 300, 350, 400 respectively. Our "golden Board"
Electronics Forum | Thu Nov 17 21:46:48 EST 2005 | C. Kolokoy
With DIP type components, a sub-par fluxing method (foaming a no-clean), and a chip wave where one is not needed are formulas for bridging and insufficient wetting. If you have SMD's on the wave solder side of the board greater than 0603, and no SOT
Electronics Forum | Thu Sep 26 23:14:25 EDT 2013 | zsoden
We picked up this old (circa late 80s) Seho 1135 machine last year for next to nothing. It needed a bit of TLC to bring it back to working order but it's 99% working now. The only problem left is that we cannot get sufficient height from the delta wa
Electronics Forum | Mon Apr 26 09:54:59 EDT 2010 | baildl632
What type of wave machine? Does your machine have a pump speed dial? Does your machine have the ability to raise and lower the pot? Raise pot to as close as possible to the pallets/boards and make sure they can pass over the nozzle without hanging o
Electronics Forum | Mon Apr 19 11:36:10 EDT 2010 | baildl632
We installed a fixed distance optical sensor above the conveyor rail and "wired it" throught he machines terminal bus to cut the pump on only when a board was present at the pot. We also installed a timer in line so the pump would only stay on long e
Electronics Forum | Thu Apr 15 10:09:55 EDT 2010 | davef
Dross formation rates for SnCu and SAC are roughly 2.5 times the rate for SnPb (Hwang et al., 2004) Methods for reducing dross are: * Lower pot temperature * Run pump speed slower and only when soldering * Check solder contaminants to BS219, ASTM
Electronics Forum | Mon Aug 30 16:14:58 EDT 1999 | Dave F
| I am building a board with T1/34 LED's in a 10X10 array there are 12 arrays in a panel. The LED's are body to body in the array, .1 spaced. The LEDS have been autoinserted on a Universal RAD III, so they are cut and clinched. The trouble I am havin
Electronics Forum | Tue Aug 31 08:10:38 EDT 1999 | Brian Conner
| I am building a board with T1/34 LED's in a 10X10 array there are 12 arrays in a panel. The LED's are body to body in the array, .1 spaced. The LEDS have been autoinserted on a Universal RAD III, so they are cut and clinched. The trouble I am havin
Electronics Forum | Mon Aug 29 12:52:21 EDT 2005 | pr
We have 2 dual head Versa-flows in line. We use them mainly for doublesided reflow jobs that have connectors and axial parts. I have about 15 jobs currently running on them. The advantage of having 2, is some of our boards have through hole on 1 side
Electronics Forum | Tue Jul 13 14:19:00 EDT 1999 | JohnW
| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec
