Electronics Forum | Wed Jan 21 12:06:48 EST 2004 | Claude
What is the most effecient form of heating ,ie calrod, IR, convection , or a mixture ? to produce a good thermal profile on a wavesoldering system on thermally challenging multi-layered boards? Thanks, Adam Adam, I agree with Pete C. Forced co
Electronics Forum | Thu Apr 28 08:29:22 EDT 2005 | andymackie
If what you are talking about is "assembly materials", then consider the following: - Solder paste - Wavesoldering fluxes - Bar (for filling wavesolder pots) - Underfill (for TCE-mismatched CSP's and flip-chip) - Cleaning fluids (for post-reflow boa
Electronics Forum | Thu Nov 12 03:58:10 EST 1998 | Earl Moon
| What are the factors that go into determining PCB Board temperature requirements for the Wavesolder process? Most of the recipes I've seen call for preheating the PCB to around 230F - 250F. This temp is about 210F - 230F below the typical solder te
Electronics Forum | Fri Feb 25 11:13:32 EST 2000 | Russ
This probably won't help much but I find it at least a little interesting. During some experimentation recently I accidently loaded a board into the wave upside down and it had a PLCC 68 package along with other types of components that had only bee
Electronics Forum | Fri Dec 01 00:30:59 EST 2000 | arminski
I have a proto-type PCB with a 48-Pin Fine Pitch TSOP (0.5mm pitch) with a dimension of 19mm L x 11.50mm W x 1.10 Thickness. They are at the bottomside of the PCB and I need to wave solder the board. There are 8 of them at the bottom side. Are they o
Electronics Forum | Fri Feb 25 11:13:32 EST 2000 | Russ
This probably won't help much but I find it at least a little interesting. During some experimentation recently I accidently loaded a board into the wave upside down and it had a PLCC 68 package along with other types of components that had only bee
Electronics Forum | Wed Apr 04 12:02:33 EDT 2001 | Adam
Guys Is it possible to completely eliminate random solder/microsolderballs from No-Clean products that go over the wave. The Assembly is a mixed technology product which is HASL finished. All profile types have been exhausted, 3 flux vendors have be
Electronics Forum | Fri Nov 13 14:39:04 EST 1998 | J.A.B.
Also the preheating of the board is done to help evaporate any water/alcohol that is in the flux - water is a big problem in No-clean processes. From our experience, a temp range around 200f - no more than 220f is ideal for the bigger boards, but tem
Electronics Forum | Wed Sep 15 05:15:24 EDT 2004 | Adam
I have chceked the fluxing application, I seem to be getting good consistent coverage across the board using our foam fluxing system. Good flux penetration on the top-side of the through-hole plating, as this was checked using a fax paper.There is no
Electronics Forum | Thu Jul 05 10:11:19 EDT 2007 | ck_the_flip
The variables to study: * Dwell Time * Contact Length * Conveyor Speed * Parallelism * Top-side Substrate Temperature Before wave * Solder Pot temperature All of these variables are inter-related (ie changing one variable will affect another)
