Industry Directory | Manufacturer
Expertise and equipment to support the most intricate and challenging wire bonding applications. Fine wire wedge bonders, heavy wire bonders, ribbon bonders for backend semiconductor assembly.
Industry Directory | Manufacturer
CoorsTek Gaiser invented the ceramic bonding tool. Our precision wire bonding tools include ceramic capillaries, wire wedges, ribbon wedges, ceramic/cermet wedges, die collets & vacuum pick-up tools.
New Equipment | Rework & Repair Equipment
Protecting Heat Sensitive Components. Are you in need of a flexible method for shielding nearby components during the PCB rework process? Do you find yourself looking for an effective heat shielding product which can be easily modified to protect a
For Wire Bonding (Wedge Bonding) with follow types; Fine Wire Wedge Heavy Wire Wedge Ribbon Wire Wedge
Electronics Forum | Thu Jul 04 23:17:24 EDT 2019 | 123456789
Today we will talk some other problems you may meet in the wedge bonding work. If you have any other supplement or suggestion, welcome to leave us message. Appear welding spot indentation on the frame, what's the causes? How to solve? 1.The Wedge’s
Electronics Forum | Thu Sep 08 07:04:02 EDT 2005 | davef
Finer pitch: Wedge bonding can be designed and manufactured to very small dimensions, down to 50 mm pitch. Processing speed: Machine rotational movements make the overall speed of the wedge bonding process less than thermosonic ball bonding. Alumin
Used SMT Equipment | Semiconductor & Solar
Becoming available soon; K&S 4124 Wire Bonding Machine currently in production to be removed in complete working condition. Contact: Assured Technical Service LLC Minneapolis, MN 55441 AssuredTechnicalServiceLLC@Gmail.com FOB Origin. The
Used SMT Equipment | Semiconductor & Solar
KNS – Kulicke & Soffa 4123 Manual Wedge Wire Bonder REFURBISHED! KNS appears to be in quite nice cosmetic condition, showing some normal signs of wear. It is being sold in working condition. Please allow two to four weeks for this
Industry News | 2011-12-21 22:41:39.0
Offering convenient and cost-effective staff development, IPC announces its Winter Webinar Series for January, February and March 2012. The one-hour webinars which focus on critical issues facing the industry, offer companies an opportunity to bring IPC technical information to a large number of employees at one time.
Industry News | 2018-10-18 09:16:42.0
New Technology for Void-free Reflow Soldering
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Parts & Supplies | AOI / Automated Optical Inspection
UNIVERSAL 47898802 FORMER INSIDE 47898802 FORMER INSIDE The following is a list of some of our products: if you can't find the part number, you can contact becky@hysmt.cn No. Part Number Description 421 47946305 PLATE, FRONT CARD CL
Parts & Supplies | Other Equipment
Universal 90055894 plug-in head body offer smt AI Parts： No. Part Number Description 1 43366107 FORMER,LEFT STD 2 43366207 FORMER,RIGHT STANDARD 3 45592408 FORMER, RIGHT STD N 4 45592508 FORMER, LEFT STD N 5 46805406 FORMER, STD LEFT 6 468064
Technical Library | 2014-07-24 16:26:34.0
Wire bonding a die to a package has traditionally been performed using either aluminum or gold wire. Gold wire provides the ability to use a ball and stitch process. This technique provides more control over loop height and bond placement. The drawback has been the increasing cost of the gold wire. Lower cost Al wire has been used for wedge-wedge bonds but these are not as versatile for complex package assembly. The use of copper wire for ball-stitch bonding has been proposed and recently implemented in high volume to solve the cost issues with gold. As one would expect, bonding with copper is not as forgiving as with gold mainly due to oxide growth and hardness differences. This paper will examine the common failure mechanisms that one might experience when implementing this new technology.
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Career Center | Philadelphia, New Jersey USA | Sales/Marketing
LOCATION BASE SALARY USA - NJ - Central USA - NJ - Southern USA - PA - Philadelphia $67000 - 73000 Another $50K to $70K in commissions based on plan COMPANY BRIEF My client is a leading supplier of automated broadband communications assembly e
Career Center | Brooklyn, New York USA | Engineering,Production
Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high performance radio frequency (RF) and microwave applications. With design, sales and manufacturing locations in over 30 countries, Mini-Ci
Career Center | , Philippines | Engineering,Technical Support
Electronic manufacturing and Semiconductor equipment programming, sustenance and preventive maintenance. Knowledge in PLC, pneumatics and automated equipment. Desktop, Laptop computer servicing trouble-shooting, repair, hardware and software instal
Career Center | , | 2013-03-07 10:18:07.0
Currently work as Equipment Engineer at Integrated Microelectronics Inc., Philippines handles Line Maintenance Technicians, that performs production equipment setup and sustenance. Implements/creates improvements on assigned area. Maintains group KRA
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BLKE01367 Lamp;14v;t-1 34;wedge WELCOME TO SHENZHEN ZHI HONGLAI TRADING CO.,LTD Sales & Support Request A Quote - Email Select Language English Home Products About Us Factory Tour Quality Control Contact Us Request A Quote All Categories Universal Instrument （UIC
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. Enclosed voids can cause a displacement of electrical and thermal paths as well as a local concentration of power and heat. Additionally, gas voids are quick to form spheres in the solder gap, which could cause the tilting of chip components and a wedge-shaped solder gap
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