About the machine please contact whatsapp 0086 134 2516 4065 D&H offers an automatic dosing machine for degassing, proportioning, mixing and high precision dosing of two component resins (epoxy, polyurethane, silicone..) in the atmospheric enviro
Technical Library | 2012-10-11 19:50:09.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. This paper shows the benefits by using a pure palladium Layer in the ENEPIG (Electroless Nickel, Electroless Palladium, Immersion Gold) and ENEP (Electroless Nickel, Electroless P
Industry News | 2010-08-19 02:11:40.0
Nordson Corporation announced that it has formed a test and inspection group within its Advanced Technology segment to better leverage the competencies of its Nordson DAGE and Nordson YESTECH subsidiaries.
Industry News | 2017-10-24 17:17:49.0
Techcon today unveiled a new logo and brand identity at The Assembly Show in Rosemont, IL. The brand launch is being rolled out in conjunction with a series of innovative new products from Techcon, beginning with the TS550R Smart Valves Controller, which can remotely control the Techcon pneumatic valve series via mobile or desktop computer, or via intuitive touch screen controls.
Industry News | 2013-10-31 11:53:09.0
Hesse GmbH will demonstrate a full range of wedge wire bonding capabilities at Productronica, taking place November 12-15 in Munich, Germany, in Hall B2, Booth 255.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Industry News | 2022-04-20 14:41:47.0
From 3D SPI to 3D AOI and 3D Bond to 3D AXI and 3D MXI, Viscom AG will showcase a wide range of innovative solutions for intelligently networked quality control at the SMTconnect international trade fair for electronics manufacturing. A special highlight features new remote service offerings under the vConnect brand. At PCIM Europe, where power electronics are in the foreground, Viscom is particularly featuring 3D AXI.
Technical Library | 2014-12-11 18:00:09.0
The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly processes. Wire bonded packages using conventional copper lead frame have been used in industry for quite some time. However, the demand for consumer electronics is driving the need for flip chip interconnects as these packages shorten the signals, reduce inductance and improve functionality as compared to the wire bonded packages. The flip chip packages have solder bumps as interconnects instead of wire bonds and typically use an interposer or organic substrate instead of a metal lead frame (...) The paper provides a general overview of typical defects and failure modes seen in package assembly and reviews the efforts needed to understand new failure modes during package assembly. The root cause evaluations and lessons learned as the factory transitioned to thin form factor packages are shared
Industry News | 2015-11-02 21:51:21.0
Nordson DAGE and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit their range of market leading Test and Inspection systems at Productronica – Stand A2:361 scheduled to take place November 10-13, 2015 at the Messe Munich Exhibition Centre in Germany. Following the acquisition of MatriX Technologies GmbH by the Nordson Corporation, the new MatriX 2.5# Automated X-ray Inspection system will also be displayed on the stand.
Industry News | 2008-07-01 15:34:36.0
Committed to promoting electronics material advancement in the burgeoning China region, Henkel and Shanghai University, in conjunction with several leading research universities, have entered into an agreement to form a Shanghai Region Joint Electronics Research and Failure Analysis Center.
