Electronics Forum | Sat Oct 09 07:33:23 EDT 1999 | Dave F
| | Can anyone tell me the formula/method to determine | | the amount of weight that solder's surface tension can support. | | (ie: Maximum weight of components soldered onto a bottom side | | of a board during a top side reflow on a Paste/Paste proc
Electronics Forum | Sat Jan 04 09:02:17 EST 2003 | davef
Q1. What is the recommended stencil thickness to apply the proper amount of solder for 0603 components? A1. The proper amount of solder is determined by: * Metal content of the solder paste. * Stencil thickness. * Aperture opening. * Other factors,
Electronics Forum | Sat Oct 10 04:58:18 EDT 1998 | Tony B
| *Reply to: ericr@nj.tanon.com | | Without going into a lengthy explaination {at this time}, has anyone experimented, tested, evaluate, and/or 'perfected' an SMT double-side reflow process. Presently I'm using a Kester R593 OA (water soluble) Sn63/
Electronics Forum | Thu Dec 08 15:27:54 EST 2005 | Samir Nagaheenanajar
Yes, yes, I agree with American man, URL, on all his points about having to know the overall process 1st. I'm surprised he doesn't have his own free consulting website. Other things you can try are: * "Dog-bone" apertures... taper down the apertur
Electronics Forum | Mon Jan 09 19:55:32 EST 2006 | davef
"Poor release" (paste hanging-up in the stencil holes) could have three main (or combination of) causes: 1 Equipment * Proper aperture area ratio provide better release * Laser cut release better than chemical etched stencil 2 Process * Snap-off dis
Electronics Forum | Tue Aug 01 08:52:53 EDT 2006 | davef
We never changed any thing after moving to imm silver. "Poor release" (paste hanging-up in the stencil holes) could have three main (or combination of) causes: 1 Equipment * Proper aperture area ratio provide better release * Laser cut release bette
Electronics Forum | Tue Sep 12 10:55:29 EDT 2006 | slthomas
I found this searching the archives. Unfortunately Bob doesn't seem to have an active site anymore, just references by people he works for. It's a shame, because there was a load of good stuff there. Haven't looked at Phil's site for a while but it's
Electronics Forum | Tue May 22 17:21:43 EDT 2001 | davef
BGA require placement accuracy of only 0.3mm (�12 thou), compared with a required placement accuracy of 0.08mm (�3 thou) for fine pitch devices. Even with this level of misalignment, plastic BGA self-center / self-correct during reflow due to symmetr
Electronics Forum | Thu Nov 18 19:45:26 EST 1999 | Deon Nungaray
Deon Response: Hello Will, Yes, you can reflow a double sided board using 63/37 solder paste on both sides. There are some limitations as far as the mass of the components to reflow the second time. If you have doubts or are concerned that a compone
Electronics Forum | Mon Jun 28 11:47:54 EDT 1999 | Christopher Cross
| | | hello, | | | | | | has anyone tried dispensing solder paste in thru holes instead of waving or hand soldering. if so how did it work out for you. | | | thanks for the input | | | | | | wayne | | | | | | | | | | | We have tried this mainly
.gif)
.gif)
