Industry News | 2018-10-09 18:31:30.0
Whether in production, or repair and rework, the cost of soldering iron tips can be easily overlooked, but with today’s requirement for higher temperatures in lead-free solder applications, the consumption of tips has dramatically increased. This fact, combined with changes in tip design to meet the higher thermal load requirements, has also resulted in escalating tip costs, making tip care a high priority.
Industry News | 2020-08-22 04:07:55.0
Indium Corporation will host an InSIDER Series webinar on causes and solutions of PCB and component warpage defects, presented by industry consultant Bob Willis. There will be two sessions on Wednesday, Sept. 9--5:30 a.m. Eastern Time (10:30 a.m. London Time, 5:30 p.m. Malaysia Time) and Noon Eastern Time (5 p.m. London Time, Midnight Malaysia Time).
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2012-07-31 15:30:56.0
Speed up manual assembly of surface mount components on printed circuit boards while improving product quality with the SMT Place 2000 manual pick and place system.
Industry News | 2020-08-05 23:24:39.0
welcome to visit Unicomp and learn more about Unicomp electronics X-Ray machine at the Booth No. 1A23.
Industry News | 2023-01-09 18:21:46.0
MicroCare™ recently announced the opening of a new warehouse and distribution centre in Leeds, West Yorkshire, England. The new location will improve service and support of MicroCare distributors and end-users throughout Great Britain, Europe and Africa. MicroCare also has two logistics centres in the United States and one in Singapore.
Industry News | 2024-03-04 11:41:49.0
KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Monterrey Expo & Tech Forum, scheduled to take place Thursday, March 14, 2024 at the Cintermex Convention Center, Hall 2A in Monterrey, Nuevo León. KYZEN will showcase the new aqueous chemistry AQUANOX A4618 in addition to highlighting stencil cleaning chemistries KYZEN E5631J and CYBERSOLV C8882.
Industry News | 2003-06-13 10:10:58.0
By combining PacTech's electroless under bump metallization (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.
Industry News | 2016-08-17 20:25:59.0
Unicomp Technology Co. Ltd., Wuxi China, has recently opened a showroom and service support center in Oceanside, CA. The 6,000 ft.2 facility includes stencil cleaning equipment and a wide range of X-ray machines for PCB assembly and fabrication, semiconductor, battery and public security scanning. Machines for demonstration are listed below:
Industry News | 2023-08-21 12:19:15.0
Gen3, a global leader in SIR (Surface Insulation Resistance), CAF (Conductive Anodic Filament), solderability, ionic contamination, and process optimization equipment, along with Zestron, renowned experts in cleaning and reliability solutions, are thrilled to announce an enlightening workshop focused on Electronics Manufacturing Processes: Where Quality Assurance Meets Surface Reliability. This informative seminar is scheduled to take place on Wednesday, September 6, 2023, at the Manufacturing Technology Centre in Ansty Park, Coventry.
