Industry News | 2023-01-09 18:21:46.0
MicroCare™ recently announced the opening of a new warehouse and distribution centre in Leeds, West Yorkshire, England. The new location will improve service and support of MicroCare distributors and end-users throughout Great Britain, Europe and Africa. MicroCare also has two logistics centres in the United States and one in Singapore.
Industry News | 2024-03-04 11:41:49.0
KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Monterrey Expo & Tech Forum, scheduled to take place Thursday, March 14, 2024 at the Cintermex Convention Center, Hall 2A in Monterrey, Nuevo León. KYZEN will showcase the new aqueous chemistry AQUANOX A4618 in addition to highlighting stencil cleaning chemistries KYZEN E5631J and CYBERSOLV C8882.
Industry News | 2003-06-13 10:10:58.0
By combining PacTech's electroless under bump metallization (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.
Industry News | 2016-08-17 20:25:59.0
Unicomp Technology Co. Ltd., Wuxi China, has recently opened a showroom and service support center in Oceanside, CA. The 6,000 ft.2 facility includes stencil cleaning equipment and a wide range of X-ray machines for PCB assembly and fabrication, semiconductor, battery and public security scanning. Machines for demonstration are listed below:
Industry News | 2023-08-21 12:19:15.0
Gen3, a global leader in SIR (Surface Insulation Resistance), CAF (Conductive Anodic Filament), solderability, ionic contamination, and process optimization equipment, along with Zestron, renowned experts in cleaning and reliability solutions, are thrilled to announce an enlightening workshop focused on Electronics Manufacturing Processes: Where Quality Assurance Meets Surface Reliability. This informative seminar is scheduled to take place on Wednesday, September 6, 2023, at the Manufacturing Technology Centre in Ansty Park, Coventry.
Industry News | 2014-09-05 13:53:06.0
AI Technology, Inc (AIT) Develops Temporary Bonding Wax for Precision Wafer and Substrate Back-grinding and Thinning Applications. AI Technology, Inc. (AIT) has recently developed a series of temporary wax-like media that has been proven to be useful in many of these thinning applications.
Used SMT Equipment | Screen Printers
DEK 2002 ELA machine. 100% working, fully serviced before shipment. Wet/dry/vacuum cleaner. 5 USC Rolls, set of squeegees and full cleaner reservoir filling included.
Technical Library | 2021-10-20 18:21:06.0
The solderability of the SAC305 alloy in contact with printed circuit boards (PCB) having different surface finishes was examined using the wetting balance method. The study was performed at a temperature of 260 _C on three types of PCBs covered with (1) hot air solder leveling (HASL LF), (2) electroless nickel immersion gold (ENIG), and (3) organic surface protectant (OSP), organic finish, all on Cu substrates and two types of fluxes (EF2202 and RF800). The results showed that the PCB substrate surface finish has a strong effect on the value of both the wetting time t0 and the contact angle h. The shortest wetting time was noted for the OSP finish (t0 = 0.6 s with EF2202 flux and t0 = 0.98 s with RF800 flux), while the ENIG finish showed the longest wetting time (t0 = 1.36 s with EF2202 flux and t0 = 1.55 s with RF800 flux). The h values calculated from the wetting balance tests were as follows: the lowest h of 45_ was formed on HASL LF (EF2202 flux), the highest h of 63_ was noted on the OSP finish, while on the ENIG finish, it was 58_ (EF2202 flux). After the solderability tests, the interface characterization of cross-sectional samples was performed by means of scanning electron microscopy coupled with energy dispersive spectroscopy.
Technical Library | 2016-12-22 16:44:04.0
Particulate matter contamination is known to become wet and therefore ionically conductive and corrosive if the humidity in the environment rises above the deliquescence relative humidity (DRH) of the particulate matter. In wet condition, particulate matter can electrically bridge closely spaced features on printed circuit boards (PCBs), leading to their electrical failure. (...) The objective of this paper is to develop and describe a practical, routine means of measuring the DRH of minute quantities of particulate matter (1 mg or less) found on PCBs.
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Used SMT Equipment | Screen Printers
1998 DEK 265LT 100% Operational / Tested 120 VAC / Single Phase Green Camera Understencil wet / dry Stencil Cleaner Magnetic Pin board support Buy off at our facility recommended (Ft. Worth, TX)
