Technical Library | 2021-08-11 01:00:37.0
Conformal coatings and potting materials continue to create issues for the electronics industry. This webinar will dig deeper into the failure modes of these materials, specifically issues with Coefficient of Thermal Expansion (CTE), delamination, cracking, de-wetting, pinholes/bubbles and orange peel issues with conformal coatings and what mitigation techniques are available. Similarly, this webinar will look at the failure modes of potting materials, (e.g Glass Transition Temperature (Tg), PCB warpage, the effects of improper curing and potential methods for correcting these situations.
Industry News | 2013-10-02 23:40:56.0
Ascentech LLC will exhibit the Gensonic UltraSonic Stencil Cleaner and the new Solder Saver at the upcoming SMTA International 2013. The Gensonic is a manually-operated, ultrasonic transducer unit for cleaning stencils used in printing solder pastes and adhesives. It can be used either directly on the printer or at a separate cleaning station.
Industry News | 2013-10-08 14:47:36.0
The Balver Zinn Group announces that it will exhibit in Hall A4, Stand 451 at the 20th international Productronica Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.
Industry News | 2010-04-10 23:59:50.0
LOS ALAMITOS, CA - Following the success of their 2007 test board and kit, Practical Components and Aim Solder have updated their offering with a new AIM print test board and kit that is designed to include many printing challenges commonly found in manufacturers' assemblies.
Industry News | 2014-02-27 17:02:28.0
The Balver Zinn Group announces that it will exhibit in Booth #2714 at the IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, NV.
Industry News | 2022-07-25 08:03:11.0
Critical cleaning experts, MicroCare LLC, has announced the launch of a new product line of Standard Presaturated IPA Wipes as an alternative for more economical surface, tool and equipment cleaning. Leveraging existing MicroCare product development and manufacturing capabilities, the new wipes deliver cleaning solutions to help manufacturers quickly get perfectly clean surfaces at the lowest cost per clean.
Technical Library | 2014-03-06 19:04:07.0
Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.
Industry News | 2019-09-26 12:16:40.0
Saki Corporation will present its 2D and 3D automated optical inspection (AOI) and 3D solder paste inspection (SPI) systems at Productronica India 2019. Productronica India is being held September 25-27 at the India Expo Center, Noida, Delhi, India. Saki technical experts will be available at the following booths: PCI booth PA11, iNETest booth PC11, and Prosem booth PE45.
Industry News | 2021-02-12 16:00:16.0
Seika Machinery, Inc. is pleased to announce its participation in the 2021 IPC APEX Virtual EXPO, scheduled to take place March 9-11, 2021 online at www.ipcapexexpo.org. Seika will highlight the Sawa SC-BM500E Automatic Ultrasonic Metal Stencil Cleaner, Sayaka SAM-CT34NJW Twin Table PCB Router with online camera for programming, Tsuchiyama n=1 Checker FAI and Kyowa PCAS Software Series for PCB Measurement.
Industry News | 2017-10-24 17:17:49.0
Techcon today unveiled a new logo and brand identity at The Assembly Show in Rosemont, IL. The brand launch is being rolled out in conjunction with a series of innovative new products from Techcon, beginning with the TS550R Smart Valves Controller, which can remotely control the Techcon pneumatic valve series via mobile or desktop computer, or via intuitive touch screen controls.
