Technical Library | 2021-05-13 16:03:25.0
Sn-based lead-free solders such as Sn-Ag-Cu, Sn-Cu, and Sn-Bi have been used extensively for a long time in the electronic packaging field. Recently, low-temperature Sn-Bi solder alloys attract much attention from industries for flexible printed circuit board (FPCB) applications. Low melting temperatures of Sn-Bi solders avoid warpage wherein printed circuit board and electronic parts deform or deviate from the initial state due to their thermal mismatch during soldering. However, the addition of alloying elements and nanoparticles Sn-Bi solders improves the melting temperature, wettability, microstructure, and mechanical properties. Improving the brittleness of the eutecticSn-58wt%Bi solder alloy by grain refinement of the Bi-phase becomes a hot topic. In this paper, literature studies about melting temperature, microstructure, inter-metallic thickness, and mechanical properties of Sn-Bi solder alloys upon alloying and nanoparticle addition are reviewed
Industry News | 2021-04-22 17:10:07.0
New ESD-Protection Diode with Wettable Flanks Features Low Capacitance to 0.37pF typical in the Compact DFN1110-3A Package
Industry News | 2017-05-01 14:53:34.0
ITW EAE’s Vitronics Soltec earned two coveted VA Excellent Awards from the SMT China Vision Awards at the recent NEPCON China exposition and conference in Shanghai. The CATHOX™ Catalytic Thermal Oxidizer was recognized in the Reflow Soldering category and the ZEVAm took the prize in the Selective Soldering category.
Industry News | 2024-05-13 10:19:11.0
SHENMAO Technology is pleased to offer its PF606-P276 Ultra-Low Void No-Clean Zero-Halogen Lead-Free Solder Paste. PF606-P276 has been specifically developed for the surface mount technology (SMT) process, offering superior void performance after the reflow process. By minimizing gas generation during reflow, this solder paste ensures exceptional reliability and performance for a wide range of electronic components and assemblies.
Industry News | 2014-05-29 18:30:08.0
Kurtz Ersa North America recently developed and released the new Mini VARIO Wave, a game changing option for its selective solder systems.
Industry News | 2014-05-29 18:32:30.0
Kurtz Ersa North America recently developed and released the new Mini VARIO Wave, a game changing option for its selective solder systems.
Industry News | 2014-05-29 18:34:33.0
Kurtz Ersa North America recently developed and released the new Mini VARIO Wave, a game changing option for its selective solder systems.
Industry News | 2015-08-20 08:16:49.0
Seika Machinery introduces the MALCOM VDM-2 Video Capture System. Used in conjunction with MALCOM Reflow Simulators, the VDM-2 camera system captures video of the simulated reflow process.
Industry News | 2016-07-07 14:29:58.0
Seika Machinery is pleased to introduce the Malcom SWB-2 Automatic Wetting Balance Tester. The automated solution has been designed for measuring the wetting force of your through-hole components using wave solder.
Industry News | 2020-01-15 15:51:08.0
Nordson MARCH, a Nordson company introduces the PROGENY™ plasma treatment system with a chamber that is 2 meters deep with overall dimensions of 660mm W x 2260mm D x 660mm H for plasma treatment of catheters at their full extended length. Plasma cleans and activates the surface prior to applying a lubricious coating and provides adhesive bonding of the balloon to the catheter. It removes contamination, impurities, and organics at the nanometer level and improves surface wettability, hydrophilicity, and bonding capabilities to address issues such as poor wetting, poor coating uniformity, voids, and poor adhesion.
