Electronics Forum | Thu Oct 03 10:02:08 EDT 2002 | davef
Your problem is likely not the Pd-Ag surface layers, but the underlying metal to which you need to wet. Either a base metal is: * Contaminated and poorly wettable. OR * A material [eg, Alloy 42 (check with magnet), Kovar, etc] that is inherently dif
Electronics Forum | Tue Oct 23 03:57:39 EDT 2007 | jkhiew
Thanks Dave. But I do not understand why the solder being wicking away by the component itself. Does Ag/Pd finishes has stronger wettability than LF HASL finishes ? Rgds
Electronics Forum | Mon Apr 28 11:13:21 EDT 2008 | ck_the_flip
Here's a crude wettability test. Take a PCB - both types of finish - print them, and reflow with no components using your standard profile. Observe the wetting spread and flow of the solder paste. This rules in/out that it's PCB solderability.
Electronics Forum | Tue Sep 02 22:21:26 EDT 2008 | davef
IPC-6012 Table 3-2. States "Fused tin-lead or solder coat - Coverage and Solderable". The lack of any specific dimension criteria doesn't make this any less a requirement. There must be complete coverage of solder on the land, and it must be wettable
Electronics Forum | Wed Feb 20 12:44:21 EST 2013 | davef
From IPC APEX ... Hege is correct ... ALL pads have to be 95% wettable or better. BR, davef
Electronics Forum | Fri Apr 18 18:06:47 EDT 2014 | davef
Methods that can reduce the wettability of OSP: * Previous heat cycles * Previous cleaning cycles * IPC-1601 "Printed Board Handling and Storage Guidelines" says do not bake prior to soldering * Using improper handling methods BR ... davef
Electronics Forum | Fri Sep 25 05:27:41 EDT 2020 | SMTA-64386317
Hi All, There is a problem which tin platting pad not able to get good wetting after reflow process while OSP pad able to achieve good platting. Where should I look to improve wettability at tin platting finishing. There is no component mounting on i
Electronics Forum | Fri Mar 11 03:23:58 EST 2005 | py (france)
ken, in order to improve the wettability I suppose.... But it seems that jimk wants N2 for the reflow owen even if he does not need N2... ==== jimk: see air-liquide, linde gaz, and praxair , you can by N2 liquid in tank , or any other conditionnemen
Electronics Forum | Thu Mar 31 19:52:50 EST 2005 | davef
We agree with Russ that you're talking palladium instead of platinum. Your wetting problem likely is not the Pd-Ag surface layers, but the underlying metal or nickel to which you need to wet. Either a base metal is: * Contaminated and poorly wettabl
Electronics Forum | Fri Nov 14 10:40:35 EST 2014 | eniac
I use a two machines from EBSO, Germany. It's a machines with PCB carrier, so, solder pot is fixed. I'm fully satisfied with this equipment, but I use only wettable nozzles. If you would like to buy a new machine, not in used condition, EBSO will be
