Electronics Forum | Tue Aug 24 13:47:14 EDT 2004 | Indy
Hi, I am trying to assemble a LTCC component with Pd/Ag surface finish on to Sn/Pb/Ag solder and Sn/Ag/Cu solder. I am passing it through a reflow. I have observed poor wettability at the solder-pad joint. Does anyone have information regarding th
Electronics Forum | Tue Aug 24 13:47:16 EDT 2004 | Indy
Hi, I am trying to assemble a LTCC component with Pd/Ag surface finish on to Sn/Pb/Ag solder and Sn/Ag/Cu solder. I am passing it through a reflow. I have observed poor wettability at the solder-pad joint. Does anyone have information regarding th
Electronics Forum | Wed Jul 19 12:54:04 EDT 2023 | calebcsmt
Since side fillets are not a requirement for QFNs/BTCs due to some packages not having wettable side terminations, how does one determine if the side terminations are actually solderable/designed for wetting? Is it simply if the side terminations
Electronics Forum | Thu Oct 26 07:24:01 EDT 2000 | gdandrea
PLEASE COULD YOU TELL ME IF THERE IS A WAY TO AVALUATE CORE FLUXED WIRES IN TERMS OF WETTABILITY/SOLDERABILITY (SOMETHING LIKE MENISCOGRAPH TEST) .I NEED A LAB TEST ALSO ONLY TO COMPARE DIFFERENT WIRES.... REALLY THANK YOU
Electronics Forum | Thu Oct 03 10:02:08 EDT 2002 | davef
Your problem is likely not the Pd-Ag surface layers, but the underlying metal to which you need to wet. Either a base metal is: * Contaminated and poorly wettable. OR * A material [eg, Alloy 42 (check with magnet), Kovar, etc] that is inherently dif
Electronics Forum | Tue Oct 23 03:57:39 EDT 2007 | jkhiew
Thanks Dave. But I do not understand why the solder being wicking away by the component itself. Does Ag/Pd finishes has stronger wettability than LF HASL finishes ? Rgds
Electronics Forum | Mon Apr 28 11:13:21 EDT 2008 | ck_the_flip
Here's a crude wettability test. Take a PCB - both types of finish - print them, and reflow with no components using your standard profile. Observe the wetting spread and flow of the solder paste. This rules in/out that it's PCB solderability.
Electronics Forum | Tue Sep 02 22:21:26 EDT 2008 | davef
IPC-6012 Table 3-2. States "Fused tin-lead or solder coat - Coverage and Solderable". The lack of any specific dimension criteria doesn't make this any less a requirement. There must be complete coverage of solder on the land, and it must be wettable
Electronics Forum | Wed Feb 20 12:44:21 EST 2013 | davef
From IPC APEX ... Hege is correct ... ALL pads have to be 95% wettable or better. BR, davef
Electronics Forum | Fri Apr 18 18:06:47 EDT 2014 | davef
Methods that can reduce the wettability of OSP: * Previous heat cycles * Previous cleaning cycles * IPC-1601 "Printed Board Handling and Storage Guidelines" says do not bake prior to soldering * Using improper handling methods BR ... davef
