Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Used SMT Equipment | Screen Printers
Ekra Model Number: E4 Year: 2000 Type: Fully Automatic In-Line Stencil Printer Windows O/S Stencil Frame Size: 29 x 29 2.5D Inspection Pressure Controlled Print Head Top PCB Register + Edge Clamp Under Stencil Wipe
Used SMT Equipment | Assembly Accessories
DEK NeoHorizon 03 iX: Machine Alignment Capability: ±12.5 µm @ 2.0 Cmk, (±6 Sigma) System Alignment Capability: +/- 20μm @ 2.0 Cmk, (±6 Sigma) Wet Print Capability: ±25 µm @ 2.0 Cpk, (±6 Sigma) - Certified by external system for every printer before
Used SMT Equipment | Screen Printers
Windows 10 Software Machine Alignment Capability: ±12.5 µm @ 2.0 Cmk, (±6 Sigma) System Alignment Capability: +/- 20μm @ 2.0 Cmk, (±6 Sigma) Wet Print Capability: ±25 µm @ 2.0 Cpk, (±6 Sigma) - Cer
Parts & Supplies | Assembly Accessories
SMT MACHINE SPARE PARTS JUKI RS-1 NOZZLE ASSEMBLY 7505 40183425 JUKI Nozzle Specifications: Brand Name JUKI RS-1 NOZZLE Part Number 40183425 Model JUKI NOZZLE 7502 7503 7504 7505 7506 Ensure Test in machine confirmation Guarantee 1 month
Parts & Supplies | Other Equipment
E93208550A0 C REFORMER SENSOR ASM. JUKI E93197270A0 THETA ORG SENSOR ASM E9319729AA0 "Z THETA 7,8 POWER CABLE ASM." E93207150A0 CENTERING MOTOR 1 ASM. E93207210A0 HEAD 3 VACUUM ON CABLE ASM. E93207250A0 HEAD 3 VACUUM ON CABLE ASM. E93207260A0
Parts & Supplies | SMT Equipment
E93208550A0 C REFORMER SENSOR ASM. JUKI E93208550A0 C REFORMER SENSOR ASM. JUKI E93197270A0 THETA ORG SENSOR ASM E9319729AA0 "Z THETA 7,8 POWER CABLE ASM." E93207150A0 CENTERING MOTOR 1 ASM. E93207210A0 HEAD 3 VACUUM ON CABLE ASM. E93207250A0
Parts & Supplies | SMT Equipment
ORIGINAL SMT SPARE PARTS JUKI 2040 ZT DRIVER E9627729000 TA8074N4E2 JUKI Nozzle Specifications: Brand Name JUKI DRIVER Part Number E9627729000 Model Number TA8074N4E2 Ensure Tested buy juki Guarantee 1 month usage for machine JUKI KE2040
Parts & Supplies | Tape and Reel
SMT MACHINE GENUINE Juki Spare Parts JUKI 775 2077 BLANK RUN TAPE E3939802000 Pats Specifications: Brand Name JUKI 775 2077 BLANK RUN TAPE Part number E3939802000 Model Ensure Test in machine confirmation Guarantee 1 month usage for mach
Parts & Supplies | Assembly Accessories
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