Electronics Forum | Fri Nov 18 08:13:57 EST 2005 | Rob
I know plenty of 1980's CP3's & IP1's still out there, and the CP4's & 6's, IP2's & 3's are still going very strong after a decade or so & still commanding top dollar second hand. It depends on how well a machine is made & the type of engineering u
Electronics Forum | Mon Feb 28 12:50:20 EST 2005 | russ
If you don't have Plated through holes you will not get any hole fill! There is nothing for the solder to wet to. Problem solved? Russ
Electronics Forum | Mon Feb 28 16:04:30 EST 2005 | Alex
I use to have that kind of problems with other type of machines and here are the causes: 1- Spray fluxer head partially obstructed (check flow rate) 2- Defective pre-heater probe (manually check temps) 3- PROFILE (last preheat to 280) 4- we sometimes
Electronics Forum | Mon Feb 28 16:21:41 EST 2005 | lyrtech
Thanks a lot to all of you! I found my problem: It was the pressure of the ultrsonic spray fluxer who was to low. The flux didn't wet all the hole and the solder didn't fill completly the hole. No one in my area knew the solution. Thanks one more ti
Electronics Forum | Mon Mar 04 15:57:33 EST 2024 | evelynn
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Electronics Forum | Tue Aug 21 21:39:19 EDT 2001 | davef
1) why is No-clean (NC) the preferred process, for BGA mounting by SMT? Probably the same reason NC is the preferred process for mounting non-area array SMT components. 2) why is water-soluble (WS) not a hot choice? There�s not reason not to use
Electronics Forum | Tue Jul 01 22:20:26 EDT 2008 | davef
Fillet Height [F]. Wetting is evident on the vertical surface of the termination as the minimum fillet height.
Electronics Forum | Wed Dec 18 16:21:54 EST 2019 | jrow
Hello! We are having field failures due to cracking of the solder on our SMD micro switch components. I have been reading the IPC standards, and the only thing that it states regarding the solder profile/amount for Gull Wing component is "wetted fill
Electronics Forum | Wed Nov 29 11:46:57 EST 2006 | slthomas
IPC 610 *C* states that the solder thickness requirement is a properly wetted termination is evident. Fillet height is another aspect and is usually specific to the package but is some function of solder thickness plus a percentage of lead height. D
Electronics Forum | Thu Jun 27 17:32:35 EDT 2013 | tpost
We recently had a question come up regarding the amount of solder on a flat underside termination ( we referenced Flat Lug Lead in IPC 610). Judging by the photo you can see on the Left is a target solder joint, but on the right is one which had rewo
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