Full Site - : wetting is evident (Page 6 of 13)

SMD Gull Wing Switch Cracking

Electronics Forum | Wed Dec 18 16:21:54 EST 2019 | jrow

Hello! We are having field failures due to cracking of the solder on our SMD micro switch components. I have been reading the IPC standards, and the only thing that it states regarding the solder profile/amount for Gull Wing component is "wetted fill

"Gap" in completed solder joint between lead and pad

Electronics Forum | Wed Nov 29 11:46:57 EST 2006 | slthomas

IPC 610 *C* states that the solder thickness requirement is a properly wetted termination is evident. Fillet height is another aspect and is usually specific to the package but is some function of solder thickness plus a percentage of lead height. D

SMT solder Covering component surface

Electronics Forum | Thu Jun 27 17:32:35 EDT 2013 | tpost

We recently had a question come up regarding the amount of solder on a flat underside termination ( we referenced Flat Lug Lead in IPC 610). Judging by the photo you can see on the Left is a target solder joint, but on the right is one which had rewo

Profiling LQFP-144 with ground plane

Electronics Forum | Thu Feb 24 20:39:05 EST 2022 | joshsvoboda

there is evidence of wetting on the heel. This is the first time I have had this type of joint using SC100C on a leaded part. Usually there is at least some wetting on the sides instead of just looking like it is pressed in and sitting on top of the

QFN welding problem by reflux oven 10 zones

Electronics Forum | Tue Feb 11 10:59:31 EST 2020 | dontfeedphils

I was going to say, technically it's BTC, so I don't believe it needs a fillet, only evidence of wetting.

Profiling LQFP-144 with ground plane

Electronics Forum | Thu Feb 24 20:13:22 EST 2022 | dwl

They don't look that bad, especially for SN100. There is evidence of wetting on the toe and the paste on the pad seems to have reflowed properly. What does the heal look like? That's the more critical part of the solder joint for Gull leaded parts.

Poor Solderability on TSOPs with Alloy 42 Leadframes

Electronics Forum | Tue Jun 28 12:12:17 EDT 2005 | Paul

I'm with DaveF on this one. I think you'll be trying solve this one for a long time. Alloy42 just doesn't like to be soldered. What exactly is the issue? Lack of a toe fillets at on the cropped lead? There is no spec for a toe fillet other than to

Incomplete reflow

Electronics Forum | Mon Apr 07 11:53:44 EDT 2014 | hegemon

It's right there in front of you. Not enough overall temperature across the board. No wetting issue is evident, just looks like you need to turn up the heat, as Dave has mentioned. SOB has mentioned the issues surrounding the Electrolytic caps, ch

Conformal coating mask dots and halos

Electronics Forum | Mon Mar 01 09:17:56 EST 2010 | duso02

Hey....I think it might be the silicone adhesive! LOL Yeah, that'll do it. We use simple Shercon paper dots. Work like a charm. No evidence of "de-wetting".

Solder paste volume require.

Electronics Forum | Thu Jun 01 08:39:36 EDT 2006 | russ

IPC a 610 has this info. An 0402 however mat require more solder than what IPC states (basically evidence of wetted fillet for class2). more paste = more flux = better wetting. Why don't you tell us what pad sizes and layout you have and stencil t


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