New Equipment | Solder Materials
NC Paste Flux is a no clean tacky/rework flux designed to wet virtually all solderable electronic surfaces, components, assemblies, and substrates. AIM NC Paste Flux may be used for general touch up or rework of printed circuit boards, and for attach
New Equipment | Solder Materials
16 hours), and abandon time (>8 hours) Improved paste transfer efficiency Printing: Suitable for high speed printing up to 125 mms-1 Improved reflow process window (high soak temperatures and time) with superior coalescence and wetting Very shiny
Electronics Forum | Thu Feb 17 04:09:19 EST 2005 | greg
The solder adheres to the lands very well so i don't think that problem is with solderability of the PCB. Not wetting to the 0805 terminations. When the problem appeared with the 0805 we chenged the supplier. But there was commnon element Pb-free te
Electronics Forum | Mon Jul 16 16:02:08 EDT 2007 | ck_the_flip
I have zero experience with SN100c, but hey, how much different can it be from Sn63Pb37?! We solder large connectors all the time - sometimes these connectors reside on a ground plane area. We've been able to overcome hole fill issues (on 63/37) th
Used SMT Equipment | Soldering - Reflow
Vitronics Soltec Delta 5 Leadfree Wave Soldering MachineBrand: VitronicsModel: Soltec Delta 5 Pb-free Wave Soldering MachineYear: 2011Serial Number: 10.91158 Specifications:Top preheat - Zone 3: IR LampsBottom preheat - Zone 1 and 3: Calrod type, Zon
Used SMT Equipment | Soldering - Reflow
Vitronics 6622CC (Pb Free) Wave Soldering Machine Brand: Vitronics Model: 6622CC Vintage: 2001 Serial Number: 0103652201 LEADFREE unit Configured with Main Wave and Chip Wave Basic system according to General Specification (GS 235) CONTRO
Industry News | 2015-03-24 10:48:06.0
Count On Tools announces that PB Swiss Tools has expanded its existing ESD Screwdriver selection with firmly mounted blades. SwissGrip ESD Screwdrivers are ideal even for difficult applications, with adjusted handle ergonomics. The expanded series is available for Slotted/Flat, Phillips, Pozidriv, Hex Bolts (socket wrench), Hex socket (allen key) and Torx ® screw profiles.
Industry News | 2021-09-02 06:12:22.0
Count On Tools, Inc. (COT) is pleased to announce that the PB Swiss Tools Labor Day Sale starts Friday, Sept. 3, 2021. Enter promo code LABORDAY to receive 15 percent off through Monday, Sept. 6, 2021. This discount can even be applied to already discounted clearance and overstock items.
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2021-12-29 19:52:50.0
Medtronic seeks to quantify the thermal aging limits of electroless Ni-electroless Pd-immersion Au (ENEPIG) surface finishes to determine how aggressive the silicon burn-in process can be without loss of solderability. Silicon burn-in (power testing at elevated temperature) is used to eliminate early field failures, critical for device reliability. Thermal aging due to burn-in or annealing causes Ni and Pd diffusion to and oxidation on the surface. Surface oxides limit wetting of the PbSn solder, affecting electrical connectivity of components soldered afterburn-in. Isothermal aging of two ENEPIG surface finishes was performed at 75°C-150°C for 100 hrs-1500hrs to test the thermal aging limits and identify how loss of solderability occurs.
Career Center | Botevgrad, Sofia Bulgaria | Engineering,Production,Quality Control,Research and Development,Sales/Marketing
AOI - Omron RNS/RNS_ptH, VI3000, Marantz 22X IPC-610D Class 3, Pb/Pb free process, 5S, FMEA, MSA, PPAP, SPC, CPK, 6Sigma, lean manufacturing, Quality management, ISO/TS 16949 ,ISO 9001,ISO 14 001
Career Center | Botevgrad, Sofia Bulgaria | Engineering,Production,Quality Control
AOI - Omron RNS_ptH, RNS-LS, VT-WIN2 VI3000 Marantz 22X IPC 610D certified ISO 9001-2008, etc automotive standards ROHS
Impact of Reflowing A Pb-free Solder Alloy Using A Tin/Lead Solder Alloy Reflow Profile On Solder Joint Integrity If you don't see images, please visit online version at #Application.SmtNet.baseURL#/express/ The Impact of Reflowing A Pb
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
[Note yellow highlighting for format reference] ABSTRACT To date, the majority of the Electronics Manufacturing industry has implemented either SAC305 or 405 alloys to manufacture Pb-free (E.U. RoHS, compliant
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer
