Electronics Forum | Mon Feb 01 16:40:45 EST 1999 | Dave Waddick
I have a product using high temperature solder to connect terminal pins to a PCB. The board is single sided copper, no plaiting. The solder is 95% tin 5 % silver. The flux is low activity rosin. The product is a subassembly. When the product is
Electronics Forum | Mon Aug 09 20:47:21 EDT 2004 | KEN
I think OA flux left on the pot would quickly looses its activity and become part of the dross waste stream, and smoke stream for that matter. Also, if your wave is setup properly your selective pallets will scour (push) the top of the lambda wav
Electronics Forum | Mon Mar 30 11:39:46 EDT 2009 | rgduval
Is this a sample board that you ran without components? If so, I'd get it back to your board house, and ask them to explain to you what's happening. We never did get to a satisfactory root cause on our issue (at least, satisfactory to me). It seem
Electronics Forum | Fri Jun 25 09:51:35 EDT 1999 | C.K.
| Dear John/Earl | | Thanks for your clarifications. To me also the problem does not seem to be linked with the PCB. The Pre heater temp. is set at | 450 degree C. We are using Alpha Aq. cleanable flux. Can you elaborate on the Desired profilin
Electronics Forum | Thu Jan 27 04:02:00 EST 2011 | richiereilly1
Hi, We had a similar issue to this. When we examined the boards at x-ray there were no apparent defects, We sent the boards for Dye and pry testing and we found that there were crack or gaps between the paste on the PCB and the BGA ball. basically th
Electronics Forum | Wed Jul 27 11:28:55 EDT 2005 | jh0n!
This may be completely normal, but I'm not used to seeing this with our old SnPb. I'm setting up reflow profiles for a SAC305 alloy, and it seems that on some of our larger pads, the flux seems to pool in the center. Is this perhaps a sign that I'm
Electronics Forum | Thu Jun 17 20:35:51 EDT 1999 | Earl Moon
| | | Does anyone know where I can find a list of things to do to when troubleshooting issues during the wave solder process? | | | | | | for example: | | | | | | Solder Bridge | | | 1.verify amount of flux been aplied. | | | 2.verify turbulance on
Electronics Forum | Mon Dec 06 03:54:57 EST 1999 | Chris May
Hi Russ, I have a similar situation. I have been told that this can be caused by the nickel, over which the gold is plated, can result in suspect joints, embrittlement etc. Some joints can even be weak and broken without much force on some of my boa
Electronics Forum | Sun Oct 13 22:19:28 EDT 2002 | mikestringer
Hi Everyone What lubricants do your maintenance people use for the chains in your Reflow ovens? The manuals for our ovens have one recommendation - but I am always open to other people�s experiences and recommendations. Another option may be easie
Electronics Forum | Tue Feb 02 12:31:26 EST 1999 | John
| I have a product using high temperature solder to connect terminal pins to a PCB. The board is single sided copper, no plaiting. The solder is 95% tin 5 % silver. The flux is low activity rosin. The product is a subassembly. When the product i
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