Electronics Forum | Tue Feb 02 12:31:26 EST 1999 | John
| I have a product using high temperature solder to connect terminal pins to a PCB. The board is single sided copper, no plaiting. The solder is 95% tin 5 % silver. The flux is low activity rosin. The product is a subassembly. When the product i
Electronics Forum | Thu Jul 25 12:25:54 EDT 2019 | davef
In “J-STD-001 Rev G Amendment 1 Process Qualification” Debbie Carboni, Global Product Line Manager, KYZEN Corp, Nashville, TN said: What change constitutes a need for requalification? Major/ Level 1 – Flux or flux-bearing materials (e.g. flux, so
Electronics Forum | Fri Jun 25 12:01:49 EDT 1999 | Earl Moon
| | Dear John/Earl | | | | Thanks for your clarifications. To me also the problem does not seem to be linked with the PCB. The Pre heater temp. is set at | | 450 degree C. We are using Alpha Aq. cleanable flux. Can you elaborate on the Desired
Electronics Forum | Fri Feb 10 12:21:44 EST 2006 | Cal Kolokoy
DaveF is correct in saying that TAL is not the best metric to use in reflow soldering. That is why paste manufacturers give such a wide range; typically 30 to 120 seconds. The peak temperature is more important, especially in the mixed Pb and Pb-F
Electronics Forum | Fri Sep 09 21:09:20 EDT 2011 | hegemon
Wow, a lot of questions here...and you are definitely doing some "tough sledding". To the point. If you have 3 - 22" zones you'll have to calc your belt speed and temperatures to match the solder paste requirements with regard to flux activation an
Electronics Forum | Wed Jun 24 13:46:41 EDT 1998 | Chris Kelly
Brian, a couple of things really stick out here... 1) You are spraying what is referred to here at the CATT as "PINK DEATH" The 3355-11 is about the most active/aggressive flux you can get your hands on. I am concerned about both the condition
Electronics Forum | Fri Jan 15 10:52:27 EST 1999 | John
| Hi all, | | I thought I'd use this forum to ask a couple general questions on fluxes for manual operations: | First - Is it OK to use a wave soldering type flux (specifically OA)? Thinking about activation temperatures and the ramp rate of the wav
Electronics Forum | Fri Dec 16 08:00:26 EST 2005 | jax
What you are most likely dealing with: Insufficient Pure Sn layer ( multiple causes ) Because elevated temperatures accelerate the diffusion process, the thickness of the Pure Sn layer will reduce during every thermal cycle... ( bakeing PCBs, S
Electronics Forum | Sun Apr 25 12:24:45 EDT 1999 | Chrys Shea
| Hello all, | | Our guys here still have some questions on the "optimized" profile which sees a more moderate ramp up straight to reflow temperatures versus the conventional profile which has a plateau at around 150 Celsius. If the optimized profi
Electronics Forum | Sun Apr 25 14:43:34 EDT 1999 | Earl Moon
| | Hello all, | | | | Our guys here still have some questions on the "optimized" profile which sees a more moderate ramp up straight to reflow temperatures versus the conventional profile which has a plateau at around 150 Celsius. If the optimized
