Technical Library | 2024-03-19 15:53:34.0
Underfill is a composite material usually made of an epoxy polymer that fills gaps between a chip and its carrier or a finished package and the PCB substrate to connect the chip to the board.
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Industry News | 2016-11-01 19:52:12.0
MIRTEC, “The Global Leader in Inspection Technology,” announces that CALTRONICS Design & Assembly, Inc., a PCB Manufacturing and Electronic Design Company, purchased an award-winning MV-6 OMNI 3D AOI Machine during SMTA International in Rosemont, IL.
Industry News | 2023-02-13 15:32:45.0
MIRTEC is pleased to announce that it awarded Bob Wons of Precision Automation & Assembly 'Manufacturers' Representative of the Year' for 2022. Brian D'Amico, President of MIRTEC Corp., presented the award to Bob Wons during the 2023 IPC APEX EXPO in San Diego, CA.
Industry News | 2003-02-27 08:22:44.0
Circatex is to open its first satellite office in mainland Europe in France.
Industry News | 2008-03-25 23:53:54.0
Comment from Brian D�Amico, President
Industry News | 2020-06-29 15:57:08.0
MIRTEC is pleased to announce that VIRTEX has selected MIRTEC as its AOI business partner. MIRTEC's Award-Winning MV-6 OMNI is the ideal 3D Inspection Solution to meet the stringent quality requirements of VIRTEX's high-reliability customers.
Industry News | 2003-02-27 08:41:52.0
Elec & Eltek International Co. Ltd. (
Industry News | 2003-04-30 08:37:19.0
Altium to preview industry-first technology at Programmable World that allows engineers to use board-level methodologies to design and implement embedded systems on FPGAs
Industry News | 2003-05-28 08:28:54.0
For June 2-4 (Mon. - Wed.)Design Automation Conference 2003
