Industry News | 2023-01-04 18:57:04.0
Atlanta, Georgia – Koh Young Technology, the industry leader in True3D measurement-based inspection solutions and the Premier Sponsor of IPC APEX EXPO, will deliver live demonstrations of its award-winning inspection and measurement solutions during the live tradeshow in the San Diego Convention Center on January 24-26, 2023, in San Diego, California. Koh Young will highlight several award-winning solutions at the Koh Young America booth (1116). The following is just a glimpse into what Koh Young will have in store for our visitors.
Technical Library | 2016-09-08 16:27:49.0
In this investigation a test matrix was completed utilizing 900 electrodes (small circuit board with parallel copper traces on FR-4 with LPI soldermask at 6, 10 and 50 mil spacing): 12 ionic contaminants were applied in five concentrations to three different spaced electrodes with five replicas each (three different bare copper trace spacing / five replications of each with five levels of ionic concentration). The investigation was to assess the electrical response under controlled heat and humidity conditions of the known applied contamination to electrodes, using the IPC SIR (surface insulation resistance) J-STD 001 limits and determine at what level of contamination and spacing the ionic / organic residue has a failing effect on SIR.
Technical Library | 2016-09-29 17:23:51.0
The old tactic of outsourcing to a low cost geography simply to deliver lowest cost direct and indirect labor was never a panacea supply chain solution. In fact, when evaluating solutions for lower volume and higher mix products typically found in the medical, industrial and public safety segments of the OEM market, IL & DL costs are only one subset of the total cost to land the product and service the ultimate customer. In this paper, there will be examination of what actual cost components should be included in a landed cost analysis, the soft costs that an OEM should consider to deliver outstanding performance in quality, logistics and delivery management of the supply chain solution. A detailed comparison using a 'case study' will be presented to demonstrate a total landed cost option versus one that is focused on IL/DL cost.
New Equipment | Assembly Services
What is High TG PCB "TG" refers to the glass transition temperature of the printed circuit board (PCB); it is the temperature point at which the PCB material begins to change. If the operating temperature exceeds the specified TG value, the circuit
Industry News | 2004-05-10 18:35:11.0
Google going public
Industry News | 2019-11-05 22:08:21.0
Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.
New Equipment | Board Handling - Storage
Alcanta PCB has grown dramatically over the last 15 years, from a small PCB manufacturer with a select group of clients back in 2004 to a full feature PCB manufacturing operation that is one of the most preferred PCB solution prov
Industry News | 2018-10-18 11:18:14.0
Making Readable Silkscreen Layouts for your Printed Circuit Board (PCB) Design
Electronics Forum | Fri Nov 03 02:32:56 EST 2006 | shivam
HI ALL, can anybody clear me what is via tenting and via pluging?? second one, if i use via in pad for an.5mm bga what care i should taken, what should be the soldermask open in top and innerlayers for via?how it will directly connect to top layer
Electronics Forum | Fri Oct 08 07:27:23 EDT 2004 | RON Z.
What is wonder solder.
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