Industry Directory | Manufacturer / Other
ISO certified global manufacturer and supplier of light-curable adhesives, coatings, oligomers, dispense systems, light-curing equipment, and technical consulting for the industrial, medical, and electronics industries.
Industry Directory | Manufacturer
Novum Glass LLC is a producer of solid glass microspheres in narrow size ranges from 1 micron to 1 mm. Our products are used in the electronic and automotive industry to control a uniform bondline to produce consistent components.
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Electronics Forum | Thu Feb 07 18:19:38 EST 2008 | mobytahoe
We are experiencing corrosion and subsequent pcb contamination from the RTV material used to secure a Power Supply. The degradation takes place over a few weeks. The power supply vendor is balking at liability, our OEM customer is screaming. Anyone
Electronics Forum | Fri Feb 08 06:26:03 EST 2008 | jdumont
Hey that was me way back! Anyways, use Dow 3140 (self leveling) or Dow 3145 (peanut butter consistency) and call it a day. No out gassing/acidic properties. 3140 also contains a UV tracer for black light inspection. Any tall caps should be epoxied if
Used SMT Equipment | Conveyors
Nutek Dual Track belt FIFO Type: NTM660DT Serial Nr.: 2015-0471A01 Year of Manufacture: 2015 Direction: Left to Right, Front track front fix, Rear track rear fix Transfer height: 950mm (+25/-40mm) PCB size: 75 – 260mm (W)/ 80 -330mm (L) Product thick
Used SMT Equipment | Adhesive Dispensers
Used machine in good condition with 1 x 635sd dispense head fitted. Was working when last used.
Industry News | 2011-06-13 17:25:04.0
GPD Global will demonstrate its award-winning Positive Cavity Displacement (PCD) Dispensing in Booth #6186 in the North Hall at the upcoming SEMICON West, scheduled to take place July 12-14, 2011 at the Moscone Center in San Francisco.
Industry News | 2011-09-12 12:04:25.0
GPD Global will showcase its Positive Cavity Displacement (PCD) 'H' Series high-resolution pumps in Booth #439 at the upcoming IMAPS 44th International Symposium on Microelectronics
Parts & Supplies | Pick and Place/Feeders
Many companies first applied SMT second-hand placement machines, and the selected placement machines were relatively stable, with low failure rate, easy maintenance, and important maintenance costs. Therefore, there are still many concerns about buyi
Parts & Supplies | Pick and Place/Feeders
Many companies first applied SMT second-hand placement machines, and the selected placement machines were relatively stable, with low failure rate, easy maintenance, and important maintenance costs. Therefore, there are still many concerns about buyi
Technical Library | 2024-08-29 18:30:46.0
The mechanical experience of consumption (i.e., feel, softness, and texture) of many foods is intrinsic to their enjoyable consumption, one example being the habit of twisting a sandwich cookie to reveal the cream. Scientifically, sandwich cookies present a paradigmatic model of parallel plate rheometry in which a fluid sample, the cream, is held between two parallel plates, the wafers. When the wafers are counterrotated, the cream deforms, flows, and ultimately fractures, leading to separation of the cookie into two pieces. We introduce Oreology (/Oriːˈɒl@dʒi/), from the Nabisco Oreo for "cookie" and the Greek rheo logia for "flow study," as the study of the flow and fracture of sandwich cookies. Using a laboratory rheometer, we measure failure mechanics of the eponymous Oreo's "creme" and probe the influence of rotation rate, amount of creme, and flavor on the stress–strain curve and postmortem creme distribution. The results typically show adhesive failure, in which nearly all (95%) creme remains on one wafer after failure, and we ascribe this to the production process, as we confirm that the creme-heavy side is uniformly oriented within most of the boxes of Oreos. However, cookies in boxes stored under potentially adverse conditions (higher temperature and humidity) show cohesive failure resulting in the creme dividing between wafer halves after failure. Failure mechanics further classify the creme texture as "mushy." Finally, we introduce and validate the design of an open-source, three-dimensionally printed Oreometer powered by rubber bands and coins for encouraging higher precision home studies to contribute new discoveries to this incipient field of study
Technical Library | 2016-09-29 17:23:51.0
The old tactic of outsourcing to a low cost geography simply to deliver lowest cost direct and indirect labor was never a panacea supply chain solution. In fact, when evaluating solutions for lower volume and higher mix products typically found in the medical, industrial and public safety segments of the OEM market, IL & DL costs are only one subset of the total cost to land the product and service the ultimate customer. In this paper, there will be examination of what actual cost components should be included in a landed cost analysis, the soft costs that an OEM should consider to deliver outstanding performance in quality, logistics and delivery management of the supply chain solution. A detailed comparison using a 'case study' will be presented to demonstrate a total landed cost option versus one that is focused on IL/DL cost.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Events Calendar | Tue Jul 13 00:00:00 EDT 2021 - Tue Jul 13 00:00:00 EDT 2021 | ,
Webinar: How to Make Social Media Work for Your Business
Events Calendar | Thu Jul 22 00:00:00 EDT 2021 - Thu Jul 22 00:00:00 EDT 2021 | ,
Webinar: Effective Strategies to Sharpen Your Focus and Concentration
Career Center | Brooklyn, New York USA | Engineering,Production
Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high performance radio frequency (RF) and microwave applications. With design, sales and manufacturing locations in over 30 countries, Mini-Ci
Career Center | tulsa, Oklahoma | Engineering
Printed Circuit Assembly Process Engineer. Seeking a position in a high-technology operation, utilizing my background supporting a progressive and growth-oriented organization. Offering the technical experience, expertise, and skills gained during th
SMT Express, Issue No. 1 - from SMTnet.com Volume 1, Issue No. 1 Thursday, June 3, 1999 Tricks of the Trade Optimizing Time/Pressure Dispensing ofAdhesives by Chrys Shea Return to Previous Page Over the past
Metal Microchannel Lamination Using Surface Mount Adhesives for Low-Temperature Heat Exchangers Metal Microchannel Lamination Using Surface Mount Adhesives for Low-Temperature Heat Exchangers by: Prawin, Paulraj , Paul, Brian K.; OSU School
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/adhesive-dispensing-systems/about-adhesives/news-search/2014versapurmelters
VersaPUR Adhesive Melters For Easy-to-clean Hot Melt Polyurethane Use | Nordson Adhesive Dispensing Systems Adhesive Dispensing Systems Corporate | Global Directory
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/when-should-a-pad-use-windowpane-paste-mask_topic2600_post10599.html
When Should A Pad Use Window-Pane Paste Mask? - PCB Libraries Forum Forum Home > Libraries > Footprints / Land Patterns New Posts FAQ Search Events Register Login When Should A Pad Use Window-Pane Paste Mask
