New Equipment | Solder Paste Stencils
EasyBraid’s stencil rolls are designed for use in SMT screen printing lines which keep stencil apertures clear of paste residues during the automatic screen printing process. They also clean the bottom of stencils, keeping them free from paste and fl
ESE screen printers outperform high-end models from the best-known manufacturers, yet cost less. The advanced-design printers are manufactured in Korea to the highest quality standards. All major components are controlled by high-precision servo moto
Electronics Forum | Fri Jun 21 12:49:58 EDT 2002 | surinder
Hi Russ, Thanks for your input.My board has SMT Chip components, SOT23,SOIC's & 2QFP (25MIL PITCH). Also,taking consideration that the board is well design for Wave.This board has been designed end of last year. We have latest model of Electrovert ma
Electronics Forum | Sat Jun 27 10:10:23 EDT 2009 | ysutariya
I'm not in assembly, but I do know of a technology called Sipad if you are only looking to do small batches. They pre-apply the solderpaste to boards with a light adhesive, which allows you to hand-place components, even micro BGA's and fine-pitch Q
Industry News | 2003-05-08 07:27:27.0
Easby Electronics is offering a line of low-cost plug and socket PCB terminal blocks in a vast range of styles and sizes, which now include 3.50 and 3.81mm pitches.
Industry News | 2020-04-14 22:14:18.0
ITW EAE is introducing an innovative new twin-nozzle developed by the Vitronics Soltec team for the ZEVA Selective Soldering System. The 3D-Twin-Nozzle™ has two nozzle diameters combined in one nozzle.
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Parts & Supplies | Pick and Place/Feeders
Samsung SME offline feeder station for 100% electronic feeders Product Description: Product Name: SME offline feeder station Brand: SAMSUNG Product Material:Steel paint Applicable models: Samsung SM Series models Weight: about 10KG This smt fe
Parts & Supplies | Pick and Place/Feeders
Which series nozzles could be used for Phlips Topaz and Emerald machine As we know, many parts are compatible for Yamaha and Philips machines, but some models their nozzles are not generic.So which series nozzles could be used for Phlips Topaz and
Technical Library | 2015-12-02 18:32:50.0
(Thermal Compression with Non-Conductive Paste Underfill) Method.The companies writing this paper have jointly developed Copper (Cu) Pillar micro-bump and TCNCP(Thermal Compression with Non-Conductive Paste) technology over the last two+ years. The Cu Pillar micro-bump and TCNCP is one of the platform technologies, which is essentially required for 2.5D/3D chip stacking as well as cost effective SFF (small form factor) package enablement.Although the baseline packaging process methodology for a normal pad pitch (i.e. inline 50μm) within smaller chip size (i.e. 100 mm2) has been established and are in use for HVM production, there are several challenges to be addressed for further development for commercialization of finer bump pitch with larger die (i.e. ≤50μm tri-tier bond pad with the die larger than 400mm2).This paper will address the key challenges of each field, such as the Cu trace design on a substrate for robust micro-joint reliability, TCNCP technology, and substrate technology (i.e. structure, surface finish). Technical recommendations based on the lessons learned from a series of process experimentation will be provided, as well. Finally, this technology has been used for the successful launching of the company FPGA products with SFF packaging technology.
Technical Library | 2023-06-12 19:00:21.0
The SMT print process is now very mature and well understood. However as consumers continually push for new electronic products, with increased functionality and smaller form factor, the boundaries of the whole assembly process are continually being challenged. Miniaturisation raises a number of issues for the stencil printing process. How small can we print? What are the tightest pitches? Can we print small deposits next too large for high mix technology assemblies? How closely can we place components for high density products? ...And then on top of this, how can we satisfy some of the cost pressures through the whole supply chain and improve yield in the production process! Today we are operating close to the limits of the stencil printing process. The area ratio rule (the relationship between stencil aperture opening and aperture surface area) fundamentally dictates what can and cannot be achieved in a print process. For next generation components and assembly processes these established rules need to be broken! New stencil printing techniques are becoming available which address some of these challenges. Active squeegees have been shown to push area ratio limits to new boundaries, permitting printing for next generation 0.3CSP technology. Results also indicate there are potential yield benefits for today's leading edge components as well. Stencil coatings are also showing promise. In tests performed to date it is becoming apparent that certain coatings can provide higher yield processing by extending the number of prints that can be performed in-between stencil cleans during a print process. Preliminary test results relating to the stencil coating technology and how they impact miniaturisation and high yield processing will be presented.
Yamaha SMT Auto Loading Feeder for SMT Chip Mounter ❙ Features of Yamaha SMT Feeder High accuracy SMT feeder, Yamaha auto loading SMT feeder, for Yamaha pick and place machine. 1.Revolutionizes feeding tape components by eliminating reliance
1.5M LED board conveyor|PCB linking conveyor|PCB inspection station for SMT assemblyhttps://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/177.html ASCEN major for the PCB conveyor and the PCB magazine loader &unloader,PCB depaneling mac
Events Calendar | Mon Mar 18 00:00:00 EDT 2019 - Mon Mar 18 00:00:00 EDT 2019 | ,
Webinar: Stencil Design for Solder Paste, In Process Inspection & Process Defects
SMTnet Express, December 31, 2015, Subscribers: 23,946, Members: Companies: 14,865, Users: 39,660 Study on Solder Joint Reliability of Fine Pitch CSP Yong Hill Liang, Hank Mao, YongGang Yan, Jindong (King) Lee; AEG, Flex (Flextronics International
SMTnet Express, August 10, 2017, Subscribers: 30,696, Companies: 10,656, Users: 23,635 High Frequency Electrical Performance and Thermo-Mechanical Reliability of Fine-Pitch, Copper - Metallized Through-Package-Vias (TPVs) in Ultra - thin Glass
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_axial-components-pitch-calculation_topic1896.xml
:01amEventually the Axial Lead Pitch will be incorporated into the Calculator. However, our programmers are very busy right now adding Schematic Symbol automation and enhancing the mathematical model for SMD pad size calculations for micro-miniature packages
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/about-us/news/nordson-asymteks-dual-simultaneous-programmable-pitch-cuts-conformal-coating-time-in-half
. Nordson ASYMTEK's unique motorized system automatically repositions the applicators to match the programmed pitch, eliminating the set-up time normally required during changeover which significantly
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