Technical Library | 2010-09-23 18:22:39.0
If you've been in electronics for any length of time, the phenomenon of tin whiskers is something you've likely heard discussed (maybe in scared whispered tones). Tin whiskers certainly aren't a new problem. In fact, some of the first published reports of the occurrence date back to the 1940’s and 1950's. But, over half a century later, we're still talking about it.
Technical Library | 2023-02-13 19:23:18.0
Spontaneously forming tin whiskers, which emerge unpredictably from pure tin surfaces, have regained prevalence as a topic within the electronics research community. This has resulted from the ROHS-driven conversion to "lead-free" solderable finish processes. Intrinsic stresses (and/or gradients) in plated films are considered to be a primary driving force behind the growth of tin whiskers. This paper compares the formation of tin whiskers on nanocrystalline and conventional polycrystalline copper deposits. Nanocrystalline copper under-metal deposits were investigated, in terms of their ability to mitigate whisker formation, because of their fine grain size and reduced film stress. Pure tin films were deposited using matte and bright electroplating, electroless plating, and electron beam evaporation. The samples were then subjected to thermal cycling conditions in order to expedite whisker growth. The resultant surface morphologies and whisker formations were evaluated.
Industry News | 2021-06-07 11:44:52.0
Photon steam aging system provides accelerated life testing simulating elongated storage conditions for high reliability applications.
Industry News | 2006-05-04 17:10:10.0
Documents to help manufacturers reduce the risk of tin whiskers in Pb-free products
Industry News | 2006-05-04 17:10:12.0
Documents to help manufacturers reduce the risk of tin whiskers in Pb-free products
Industry News | 2006-05-04 17:10:18.0
Documents to help manufacturers reduce the risk of tin whiskers in Pb-free products
Technical Library | 2015-03-04 10:56:26.0
As the proliferation of modern day electronics continues to drive miniaturization and functionality, electronic designers/assemblers face the issue of environmental exposure and uncommon applications never previously contemplated. This reality, coupled with the goal of reducing the environmental and health implications of the production and disposal of these devices, has forced manufacturers to reconsider the materials used in production. Furthermore, the need to increase package density and reduce costs has led to the rapid deployment of leadless packages such as QFN, POP, LGA, and Micro-BGA. In many cases, the manufacturers of these devices will recommend the use of no clean fluxes due to concerns over the ability to consistently remove flux residues from under and around these devices. These concerns, along with the need to implement a tin whisker mitigation strategy and/or increase environmental tolerance, have led to the conundrum of applying conformal coating over no clean residues.
Industry News | 2021-01-26 11:24:31.0
New Vishay Vitramon MLCCs with Lead-Bearing Finish Termination Offer Tin Whisker Mitigation and Automotive Grade Reliability for Aerospace Applications
Industry News | 2011-09-23 21:12:22.0
R&D Technical Services. announces that David Suihkonen, President, will chair a technical session at the upcoming SMTA International Conference & Exhibition
Industry News | 2012-03-15 18:09:12.0
Kyzen will co-host a workshop with ACI Technologies, Inc. to discuss circuit board cleaning and conformal coating. The workshop is scheduled to take place March 21-22, 2012 from 8:30 a.m.-4:30 p.m. at ACI’s facility in Philadelphia, PA.
