Full Site - : whisker mitigation (Page 7 of 11)

ePAK International Purchases Hentec/RPS Photon Steam Aging System

Industry News | 2021-12-06 15:28:38.0

Photon steam aging system provides accelerated life testing simulating elongated storage conditions for high reliability applications.

Hentec Industries, Inc. (RPS Automation)

Hentec/RPS Receives Order from Spirit Electronics for Photon Steam Aging System

Industry News | 2022-02-14 16:16:50.0

Photon steam aging system provides accelerated life testing simulating elongated storage conditions for high reliability applications.

Hentec Industries, Inc. (RPS Automation)

Murrietta Circuits Offers Re-Tinning Services

Industry News | 2012-10-29 15:37:50.0

Murrietta Circuits now offers an entire menu of Re-Tinning capabilities

Murrietta Circuits

Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow- Results of an Industry Round-Robin

Technical Library | 2017-10-12 15:45:25.0

The risk associated with whisker growth from pure tin solderable terminations is fully mitigated when all of the pure tin is dissolved into tin-lead solder during SMT reflow. In order to take full advantage of this phenomenon, it is necessary to understand the conditions under which such coverage can be assured. A round robin study has been performed by IPC Task group 8-81f, during which identical sets of test vehicles were assembled at multiple locations, in accordance with IPC J-STD-001, Class 3. All of the test vehicles were analyzed to determine the extent of complete tin dissolution on a variety of component types. Results of this study are presented together with relevant conclusions and recommendations to guide high reliability end-users on the applicability and limitations of this mitigation strategy.

Raytheon

NPL to Host SMART Group Conformal Coating Event

Industry News | 2013-09-03 08:16:49.0

SMART Group announces that it will host “Improving Reliability with Conformal Coating” on Thursday, 24th October at the NPL facility in Teddington, London.

The SMART Group

Circuit Technology Center to Increase Component Level Modification Services Capacity

Industry News | 2021-08-25 16:20:31.0

Two additional Hentec/RPS Odyssey 1325 RHSD machines will expand high reliability BGA alloy exchange and component re-finishing capabilities.

Hentec Industries, Inc. (RPS Automation)

CALCE Welcomes Industry Leaders at Spring EPSC Technical Review and SARA Workshop

Industry News | 2010-04-09 23:16:14.0

Continuing its efforts to provide the electronics industry with the most current and relevant research on life cycle engineering, CALCE holds semi-annual technical reviews to apprise Electronics Products and Systems Consortium members on CALCE research and project development.

CALCE Center for Advanced Life Cycle Engineering

AIM Solder’s Karl Seelig to Present during S12 Technical Session at IPC APEX 2013

Industry News | 2013-01-18 16:47:20.0

AIM Solder announces that its VP of Technology Karl Seelig will present his paper titled “Conformal Coating Over No-Clean Flux” at the upcoming IPC APEX Expo

AIM Solder

Gen3 Systems to Present SIR Intercomparison to Validate the use of a Fine Pitch Pattern

Industry News | 2017-02-09 08:35:06.0

FARNBOROUGH, UK ― February 2017 ― Gen3 Systems Limited, a specialist British manufacturer and distributor, is pleased to announce that its Chief Technology Officer Dr Chris Hunt will present the paper titled “SIR intercomparison to validate the use of fine pitch pattern” at the upcoming IPC APEX EXPO. The presentation will be held during the session titled “SIR/Flux Reliability” on Tuesday the 14th February between 15:30 – 17:00pm in location 4.

Gen3 Systems


whisker mitigation searches for Companies, Equipment, Machines, Suppliers & Information