Full Site - : whit spots solder mask (Page 5 of 10)

Re: HELP!! via sizes, location

Electronics Forum | Wed Oct 06 04:23:09 EDT 1999 | Brian

| | I am a new employee at a company that has had a large turnover of employees over the past year. I am working on a board (components on one side only), the engineer (he is also new ) wants to use an .035 pad with a .021 dia. hole, there are no via

Re: Micro balls on gold fingers

Electronics Forum | Tue May 19 12:29:59 EDT 1998 | Richard Jackson

| Richard, | You may be encountering solder paste contamination | on the assembly during the printing process. Solder | will reflow on tin/lead plated lands therefore invisible. | If you are washing the assembly prior to inspection | then you are

Re: Residue

Electronics Forum | Tue May 26 15:53:39 EDT 1998 | Chrys

| We recently made the switch to no-clean and the wurface mount is turning out beautifully. However, the wave solder process continues to put up a fight; we are getting a white residue on the surface of the PCB. The residue is not localized to

Re: Residue

Electronics Forum | Tue May 26 16:35:53 EDT 1998 | Ryan Jennens

| | We recently made the switch to no-clean and the wurface mount is turning out beautifully. However, the wave solder process continues to put up a fight; we are getting a white residue on the surface of the PCB. The residue is not localized

Re: Trapped Flux Under Component

Electronics Forum | Tue Nov 30 16:50:20 EST 1999 | Dave F

Greg: It depends on the specifics of the flux you are using. You didn�t say. Generally, using a: � "No-clean flux" should create no flux entrapment problems for most applications. � RMA with 25% or more solids as a "no-clean" should create no flu

PCB Surface finish

Electronics Forum | Mon Jul 05 03:44:53 EDT 2004 | johnwnz

Dave, I'm going to disagree with you on the ENIG, it's my 3rd choice only just beating out OSP for that 4th spot. 1. Immersion Silver - cheaper than ENIG, as flat and no issues with Brittle interface (black pad) or Gold Embrittlement) Longer shelf l

Mirtec programming discussion

Electronics Forum | Fri Nov 05 18:47:31 EDT 2010 | eadthem

I'm guessing when you say bare board you mean wet paste only? When you say the pads move slightly are your boards warped at all at the Vscore? What we do is use per modual fids. first you delete or don't make panel fids and then theres a option wh

Re: bare board problem

Electronics Forum | Fri Jun 18 10:46:10 EDT 1999 | Scott Cook

| | | first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pads

Re: Micro balls on gold fingers

Electronics Forum | Tue May 19 10:23:06 EDT 1998 | Mike C

| Howdy Richard, | Welcome to the club! I now dub thee a full fledged member of the "Spotty Gold Finger and Bleeding Ulcer Society"...or SGFBUS for short... (GRIN) | I know it's not funny to be in that position, but there's so many different places t

Re: Residue

Electronics Forum | Wed May 27 09:56:39 EDT 1998 | Chrys

| | | We recently made the switch to no-clean and the wurface mount is turning out beautifully. However, the wave solder process continues to put up a fight; we are getting a white residue on the surface of the PCB. The residue is not localize


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