Electronics Forum | Wed Oct 06 12:03:12 EDT 1999 | Graham Naisbitt
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Tue Oct 13 22:22:14 EDT 1998 | mike
| All Y'll | | How do you clean components that must be added to an assembled board after water wash? | | BACKGROUND | | Our basic process goes like this: | | 1 Print paste with OA flux, place, reflow, wash | 2 Repeat 1 | 3 Insert PTH, OA flux
Electronics Forum | Fri Oct 16 13:11:49 EDT 1998 | Steve A
The Kyzen product was brought to my attention from a chemist at Kester solders when I asked him what could remove no clean residue from a PCB that had been built weeks earlier. We soaked it in the Kyzen for 8 minutes and ran the board through the aq
Electronics Forum | Mon Feb 27 17:08:15 EST 2006 | GS
3,5 ugr/cm2 NaCl) or power components, or Raw PCB. Nothing with the solder process or fluxes. Ion Chromatography analysis was necessary to help understanding of contamination origin. When occasionally we run TIC on a NC assembled PBA (Paste ROL0 or
Electronics Forum | Thu Mar 26 23:17:04 EST 1998 | Marty Fox
| | | Is there anyone out there required by their customer to clean the finget tab contacts even after using noclean paste? We have been asked to clean even though we don't have any flux residue on the contacts. Any ideas? | | | Mike | | | | Yes a
Electronics Forum | Wed Oct 06 00:26:04 EDT 1999 | Karlin
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
Electronics Forum | Thu Oct 18 06:29:20 EDT 2001 | Yngwie
Dave, yes, your assumption is right, We only do washing after the second reflow. The timing from the post primary reflow to wash is no longer than 2 hour. The line config is as such : DEK265 � 3x MV2F- 1x MSF � BTU - AOI � DEK265 � 3x MV2F � 1x MSF-
Electronics Forum | Wed Oct 06 11:40:41 EDT 1999 | Debbie Alavezos
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Mon Jul 12 11:35:27 EDT 2004 | Pierre RICHARD
Here are some answers to my questions after a good research. I also added more definitions that could help understand this esoteric language used in assembly, specially surrounding fluxes and their use. In blue italics are comments and extracts from
Electronics Forum | Fri Nov 07 12:48:31 EST 2003 | rholland
I have seen in the last couple of months more boards with a white hazing under the solder mask. I ran a few tests on a board to determine the cause of the white hazing underneath the solder mask. First I confirmed, or at least I think I confirmed, t
