Electronics Forum | Tue Apr 23 14:20:48 EDT 2002 | russ
We have not yet sent this out for analysis, So, I don't really know what it is. initial evaluation would lead me to believe that it is flux since it is only present on the solder joints themselves and nowhere else. I noticed that you also mentioned
Electronics Forum | Fri Apr 07 09:03:07 EDT 2017 | pavel_murtishev
jng123, Process-wise using one solder paste type is preferred regardless of paste type. If you want clean both paste types in one cleaning machine your manufacturer might have, this potentially could lead to white residue issue due to chemical reac
Electronics Forum | Tue Apr 13 17:48:54 EDT 2004 | davef
Q1: Can anyone explain to me about the effect of their mixture. A1: What is their �mixture�? Q2: What enhancement does my BGA will have when using a WS paste flux with regards to corrosion, 25 years life cycle of the solder joint. A2: Tough to say
Electronics Forum | Thu Mar 26 23:17:04 EST 1998 | Marty Fox
| | | Is there anyone out there required by their customer to clean the finget tab contacts even after using noclean paste? We have been asked to clean even though we don't have any flux residue on the contacts. Any ideas? | | | Mike | | | | Yes a
Electronics Forum | Wed Oct 06 03:58:25 EDT 1999 | Brian
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
