Technical Library | 2023-05-22 16:49:42.0
Our customers' issues • Apertures are getting smaller • Paste does not release as well • Contaminates the bottom of the stencil • Increases defects / reduces yield Insufficient solder Bridging Solder balls on surface of PCB Flux residue • Requires more frequent cleaning • Reduced efficiency (wasted time) • Increased use of consumables (cost) USC fabric (use "cheap" fabric to reduce cost) Lint creates more defects Cleaning chemistries (use IPA to reduce cost) IPA breaks down flux and can create more defects
Water-based cleaning agent for SMT stencil printer underside wipe systems VIGON® UC 160 based on MPC® Technology, is a water-based cleaning agent designed to effectively remove solder paste residues from fine pitch stencil apertures in SMT printer
Industry Directory | Consultant / Service Provider
Florachem provides cleaning agents including products for defluxing,stencil/misprint cleaning and removal of white residue. We also supply rosin derivatives for manufacture of solder fluxes and pastes
Industry News | 2017-11-07 08:35:51.0
blu-SAT Presaturated IPA Cleaning Wipes from Blue Thunder Technologies are available in eleven unique variations. Low-linting and saturated with IPA and DI water, the blu-SAT line consist of options suitable for a variety of controlled environment classes including ISO 3-4, 5 and higher.
New Equipment | Cleaning Agents
Introducing DJAW-10, our efficient under stencil wipe solvent compatible with all AIM solder pastes. Ideal for manual or automated application, DJAW-10 reduces solder paste dry-out, enhances fine aperture release, and cuts wipe cycles by 50% compared
New Equipment | Cleaning Agents
CYBERSOLV® C8622 is a full strength solvent blend specifically designed as an IPA alternative in stencil wiping and manual bench top cleaning applications. Easy to use, C8622 is applied in applications where IPA is typically used. Safe IPA Alterna
Technical Library | 2023-12-26 17:50:54.0
In this white paper, we discuss the pros and cons of five analytical techniques when applied to residue analysis on electronic assemblies. We evaluate the following for their application and limitations for analyzing both visible and invisible residues: FITR, SEM/EDX, XRF, Ion Chromatography, and ROSE
Industry News | 2016-03-30 20:18:20.0
KYZEN today announced plans to exhibit in Stand C111 at NEPCON Korea, scheduled to take place April 6-8th at the COEX Exhibition Center in Seoul. The company’s cleaning experts will showcase safe IPA alternatives that help improve the cleaning process and increase production yields.
Industry News | 2016-06-15 20:28:29.0
KYZEN today announced plans to exhibit in Stand B05 at NEPCON West China, scheduled to take place June 21-23, 2016, at the New International Convention & Exposition Center in Chengdu, China. KYZEN’s cleaning experts will showcase safe IPA alternatives that help improve the cleaning process and increase production yields.
VIGON® RC 303 is a water-based cleaning agent specifically developed to remove all types of baked-on flux residues from reflow ovens and wave solder systems. Also, it removes re-condensed fluxes and emissions from condensation traps and heat exchange
