Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 2
Industry News | 2009-09-03 12:06:15.0
SMTA China announces that it presented awards for seven papers at the SMTA China South 2009 Conference Award Presentation Ceremony, held on Thursday, August 27, 2009 at the Shenzhen Ritz-Carlton Hotel in conjunction with the SMTA Hong Kong Chapter Annual Breakfast Reception.
Industry News | 2011-01-22 00:27:29.0
Design, assembly, soldering, repair, rework, inspection, and materials choice are all variables to be juggled as electronics manufacturers worldwide work with new component types, high speed signals and lead-free technology. To assist them in making the best choices for producing reliable electronics, IPC — Association Connecting Electronics Industries® is holding the IPC Conference on Quality, Reliability and Acceptability for Electronics Manufacturing in Budapest, Hungary, on 22–24 February 2011.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Technical Library | 1999-05-07 10:47:00.0
White residue remaining after cleaning circuit board assemblies can be caused by a variety of chemicals and reactions. Rosin and water-soluble fluxes, circuit board resins and epoxies, component materials and other contamination all contribute to this complex chemistry. This paper discusses many of the sources of the residues that seem to be an ever-increasing occurrence.
Technical Library | 2023-05-22 16:49:42.0
Our customers' issues • Apertures are getting smaller • Paste does not release as well • Contaminates the bottom of the stencil • Increases defects / reduces yield Insufficient solder Bridging Solder balls on surface of PCB Flux residue • Requires more frequent cleaning • Reduced efficiency (wasted time) • Increased use of consumables (cost) USC fabric (use "cheap" fabric to reduce cost) Lint creates more defects Cleaning chemistries (use IPA to reduce cost) IPA breaks down flux and can create more defects
Water-based cleaning agent for SMT stencil printer underside wipe systems VIGON® UC 160 based on MPC® Technology, is a water-based cleaning agent designed to effectively remove solder paste residues from fine pitch stencil apertures in SMT printer
Industry Directory | Consultant / Service Provider
Florachem provides cleaning agents including products for defluxing,stencil/misprint cleaning and removal of white residue. We also supply rosin derivatives for manufacture of solder fluxes and pastes
Industry News | 2017-11-07 08:35:51.0
blu-SAT Presaturated IPA Cleaning Wipes from Blue Thunder Technologies are available in eleven unique variations. Low-linting and saturated with IPA and DI water, the blu-SAT line consist of options suitable for a variety of controlled environment classes including ISO 3-4, 5 and higher.
Technical Library | 2023-12-26 17:50:54.0
In this white paper, we discuss the pros and cons of five analytical techniques when applied to residue analysis on electronic assemblies. We evaluate the following for their application and limitations for analyzing both visible and invisible residues: FITR, SEM/EDX, XRF, Ion Chromatography, and ROSE
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