Industry Directory | Consultant / Service Provider
Florachem provides cleaning agents including products for defluxing,stencil/misprint cleaning and removal of white residue. We also supply rosin derivatives for manufacture of solder fluxes and pastes
New Equipment | Cleaning Agents
CYBERSOLV® C8622 is a full strength solvent blend specifically designed as an IPA alternative in stencil wiping and manual bench top cleaning applications. Easy to use, C8622 is applied in applications where IPA is typically used. Safe IPA Alterna
Your very best choice for lead-free fluxes and pastes, this cleaner is the least-expensive nonflammable, ozone-safe cleaner on the market today. Not only does it remove lead-free residues, it actually prevents the formation of white residues. It's no
Electronics Forum | Wed Jan 27 19:42:34 EST 1999 | parag palshikar
i am working with the noclean process and getting white residues on the bottomside of the board probably due to the wave soldering flux.i am using a no-clean solder paste and a noclean wave solder flux.The boards passed the accelerated temperature a
Electronics Forum | Thu Jan 28 08:42:43 EST 1999 | Dave F
| i am working with the noclean process and getting white residues on the bottomside of the board probably due to the | wave soldering flux.i am using a no-clean solder paste and a noclean wave solder flux.The boards passed the accelerated temperatu
Used SMT Equipment | General Purpose Test & Measurement
Stanford Research SR785 The Stanford Research SR785 Two-Channel Dynamic Signal Analyzer is a precision, full-featured signal analyzer that offers state-of-the-art performance at a price that's less than half that of competitive analyzers. Buildin
Industry News | 2003-06-05 08:11:23.0
Kerry co-solvent system pays for itself in 13 months
Industry News | 2009-09-03 12:06:15.0
SMTA China announces that it presented awards for seven papers at the SMTA China South 2009 Conference Award Presentation Ceremony, held on Thursday, August 27, 2009 at the Shenzhen Ritz-Carlton Hotel in conjunction with the SMTA Hong Kong Chapter Annual Breakfast Reception.
Technical Library | 2023-05-22 16:49:42.0
Our customers' issues • Apertures are getting smaller • Paste does not release as well • Contaminates the bottom of the stencil • Increases defects / reduces yield Insufficient solder Bridging Solder balls on surface of PCB Flux residue • Requires more frequent cleaning • Reduced efficiency (wasted time) • Increased use of consumables (cost) USC fabric (use "cheap" fabric to reduce cost) Lint creates more defects Cleaning chemistries (use IPA to reduce cost) IPA breaks down flux and can create more defects
Technical Library | 1999-05-07 10:47:00.0
White residue remaining after cleaning circuit board assemblies can be caused by a variety of chemicals and reactions. Rosin and water-soluble fluxes, circuit board resins and epoxies, component materials and other contamination all contribute to this complex chemistry. This paper discusses many of the sources of the residues that seem to be an ever-increasing occurrence.
Water-based cleaning agent for SMT stencil printer underside wipe systems VIGON® UC 160 based on MPC® Technology, is a water-based cleaning agent designed to effectively remove solder paste residues from fine pitch stencil apertures in SMT printer
VIGON® RC 303 is a water-based cleaning agent specifically developed to remove all types of baked-on flux residues from reflow ovens and wave solder systems. Also, it removes re-condensed fluxes and emissions from condensation traps and heat exchange
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 1
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 2
KingFei SMT Tech | http://www.smtspare-parts.com/sale-8534415-fuji-cp6-smt-filter-cotton-wph2030-for-pick-and-place-machine.html
) AQNA - 3320/24 IP3 - Ø 15.0 (FIXED) (102 x 102mm) AQNA - 3330/34 IP3 - Ø 6.5 (FIXED) (52 x 52mm) IPA - 0007 IP - LL ADAPTOR Ø 7.0 IPA - 0010 IP - LL ADAPTOR Ø
Heller Industries Inc. | https://hellerindustries.com/fluxless-soldering/
. Using flux, however, has its drawbacks: Flux can outgas during the reflow process creating solder voids. Flux leaves behind a residue which needs to be cleaned post reflow
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