Industry News | 2011-08-01 16:38:05.0
Taking place from August 30 to September 1 at the Shenzhen Convention & Exhibition Center, NEPCON South China 2011 will span nearly 30,000 sqm and attract more than 500 exhibitors from 22 countries and regions.
Technical Library | 2013-04-11 15:43:17.0
With the explosion of growth in handheld electronics devices, manufacturers have been forced to look for ways to reinforce their assemblies against the inevitable bumps and drops that their products experience in the field. One method of reinforcement has been the utilization of underfills to "glue" certain SMDs to the PCB. Bumped SMDs attached to the PCB with a no-clean soldering process offer the unavoidable scenario of the underfill coming in contact with a flux residue. This may or may not create a reliability issue... First published in the 2012 IPC APEX EXPO technical conference proceedings
Technical Library | 2018-11-20 21:33:57.0
There are several industry-accepted methods for determining the reliability of flux residues after assembly. The recommended methods of test sample preparation do not always closely mimic the thermal cycle experienced by an assembly. Therefore, extraction from actual assemblies has become a popular method of process control to assess consistency of post-reflow cleanliness. Every method of post-reflow flux residue characterization will depend on the reflow process followed to prepare the coupon.This investigation will focus on the effect of thermal conditions on the remainder of active ingredients in flux residues after assembly with no-clean solder pastes.
Technical Library | 2016-12-29 15:37:51.0
The reliabilities of the flux residue of electronic assemblies and semiconductor packages are attracting more and more attention with the adoption of no-clean fluxes by majority of the industry. In recent years, the concern of "partially activated" flux residue and their influence on reliability have been significantly raised due to the miniaturization along with high density design trend, selective soldering process adoption, and the expanded use of pallets in wave soldering process. When flux residue becomes trapped under low stand-off devices, pallets or unsoldered areas (e.g. selective process), it may contain unevaporated solvent, "live" activators and metal complex intermediates with different chemical composition and concentration levels depending on the thermal profiles. These partially-activated residues can directly impact the corrosion, surface insulation and electrochemical migration of the final assembly. In this study, a few application tests were developed internally to understand this issue. Two traditional liquid flux and two newly developed fluxes were selected to build up the basic models. The preliminary results also provide a scientific approach to design highly reliable products with the goal to minimize the reliability risk for the complex PCB designs and assembly processes. This paper was originally published by SMTA in the Proceedings of SMTA International
Technical Library | 2013-12-05 17:09:03.0
The functionality of electronic devices continues to increase at an extraordinary rate. Simultaneously consumers are expecting even more and in ever smaller packages. One enabler for shrinking electronics has been the flexible circuit board that allows the circuit board to fit a wide variety of shapes. Flexible printed circuits (FPC) have the capability to be very thin and can have unpackaged components directly attached using surface mount technology (SMT) and flip chip on flex technologies. Bare die can also be thinned and attached very close to the circuit board. However one caveat of high density flexible circuit boards with thin die is that they can be very fragile. The use of back side films and underfill can protect the die making circuits more robust. For underfill to work well it requires good adhesion to the circuit board which can mean that flux residues under the die normally must be removed prior to underfilling.
Industry Directory | Consultant / Service Provider
Florachem provides cleaning agents including products for defluxing,stencil/misprint cleaning and removal of white residue. We also supply rosin derivatives for manufacture of solder fluxes and pastes
Industry News | 2011-05-06 21:39:30.0
Kyzen announces that Phil Zhang, its China Sales Manager, will present twice during the upcoming SMTA China East conference, which is being held in conjunction with NEPCON China 2011.
Industry News | 2016-06-28 15:32:21.0
KIC announces that on July 13 at 9 a.m. Pacific/12 p.m. Eastern, Miles Moreau and Bjorn Dahle of KIC will present content from the company’s latest white paper in a free, live webinar.
Industry News | 2011-03-21 12:50:21.0
Kyzen announces that Dr. Mike Bixenman will present a paper titled "New Cleaning Agent Designs for Removing No-Clean Lead-Free Flux Residues" at the upcoming IPC APEX EXPO
Industry News | 2011-06-16 15:01:31.0
Kyzen announces that Dr. Mike Bixenman will host an upcoming IPC Webinar titled “Cleaning Highly Dense Circuit Assemblies and Advanced Packages” on Tuesday, July 19, 2011 from 10-11 a.m. CST.
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
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