Industry News | 2003-08-27 10:43:02.0
This 41-page document is the complete source for printed circuit board and electronics assembly standards and publications for design, materials, manufacturing, assembly, quality and test.
Technical Library | 1999-05-07 10:47:00.0
White residue remaining after cleaning circuit board assemblies can be caused by a variety of chemicals and reactions. Rosin and water-soluble fluxes, circuit board resins and epoxies, component materials and other contamination all contribute to this complex chemistry. This paper discusses many of the sources of the residues that seem to be an ever-increasing occurrence.
Industry News | 2017-11-05 08:55:02.0
Removing contamination from printed circuit boards remains a huge reliability and warranty issue for PCB manufacturers. One of the cleaning experts from MicroCare Corp., the industry’s leading manufacturer of critical cleaning products, addressed that specific issue at the Texas Cleaning and Reliability Workshops in Austin and Dallas on Oct. 23rd and 25th, 2017.
Industry News | 2009-08-20 15:16:57.0
August 2009 — Cobar Solder Products, part of the Balver Zinn Group, announces that MicroTech Manufacturing, a contract manufacturer in the Phoenix area, now is using Cobar SN100C-XF3 as the standard lead-free solder paste for all its customers unless specifically directed to use a different material.
Industry News | 2008-07-14 19:56:54.0
Labtech Microwave, one of the UK's leading design and manufacturers of microwave solutions and bespoke microwave component technology has reported a successful MTT-S/IMS show 2008.
Industry News | 2011-04-04 15:57:24.0
Aqueous Technologies Corp. announces that CEO Michael Konrad will present the paper titled "Conductive Crystals, White Residues, and Lower Reliability — The Rush to Clean No-Clean" at the upcoming International Conference on Soldering & Reliability (ICSR).
Industry News | 2017-09-04 16:39:34.0
The cleaning experts at MicroCare Corp., the industry’s leading manufacturer of critical cleaning, coating and lubrication products, will showcase their family of cleaning products at SMTA International in Illinois from 17-21 September. For 2017, the company is focusing on their newest electronics cleaner, Tergo™ High Performance Flux Remover.
Industry News | 2012-08-15 10:30:35.0
LPKF Laser & Electronics will present a live webinar on September 4, 2012 at 11 a.m. PDT.
Technical Library | 2013-12-05 17:09:03.0
The functionality of electronic devices continues to increase at an extraordinary rate. Simultaneously consumers are expecting even more and in ever smaller packages. One enabler for shrinking electronics has been the flexible circuit board that allows the circuit board to fit a wide variety of shapes. Flexible printed circuits (FPC) have the capability to be very thin and can have unpackaged components directly attached using surface mount technology (SMT) and flip chip on flex technologies. Bare die can also be thinned and attached very close to the circuit board. However one caveat of high density flexible circuit boards with thin die is that they can be very fragile. The use of back side films and underfill can protect the die making circuits more robust. For underfill to work well it requires good adhesion to the circuit board which can mean that flux residues under the die normally must be removed prior to underfilling.
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
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