Full Site - : white residue on wet circuit boards (Page 4 of 17)

Seika Machinery Offers Year-End Sale on McDry, Sawa, Sayaka & Malcom Products

Industry News | 2022-10-28 05:51:41.0

Seika Machinery, Inc. is pleased to announce its year-end sale on select products. Significant savings are available for McDry cabinets, Sawa ultrasonic stencil cleaners, Sayaka PCB routers and Malcom process control equipment while stock lasts.

Seika Machinery, Inc.

Kyzen’s Mike Bixenman to Present R.O.S.E Research at International Conference on Soldering and Reliability

Industry News | 2010-05-05 21:05:42.0

NASHVILLE — Kyzen, the world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Dr. Mike Bixenman will present a paper titled "Improving the R.O.S.E. Process Control and Quality Assurance Method" at the upcoming International Conference on Soldering and Reliability (ICSR), which is co-located with the Lead-Free Academy and SMTA Toronto Expo and Tech Forum.

KYZEN Corporation

Indium Corporation Experts Reflect on 80 Years of Technology Innovation and Growth

Industry News | 2014-03-13 11:57:36.0

What does it take to make it to 80 years in an industry where today's technology is obsolete tomorrow? For Indium Corporation, it takes foresight and dedication.

Indium Corporation

Characterization, Prevention and Removal of Particulate Matter on Printed Circuit Boards

Technical Library | 2016-12-22 16:44:04.0

Particulate matter contamination is known to become wet and therefore ionically conductive and corrosive if the humidity in the environment rises above the deliquescence relative humidity (DRH) of the particulate matter. In wet condition, particulate matter can electrically bridge closely spaced features on printed circuit boards (PCBs), leading to their electrical failure. (...) The objective of this paper is to develop and describe a practical, routine means of measuring the DRH of minute quantities of particulate matter (1 mg or less) found on PCBs.

IBM Corporation

Effects of PCB Substrate Surface Finish and Flux on Solderability of Lead-Free SAC305 Alloy

Technical Library | 2021-10-20 18:21:06.0

The solderability of the SAC305 alloy in contact with printed circuit boards (PCB) having different surface finishes was examined using the wetting balance method. The study was performed at a temperature of 260 _C on three types of PCBs covered with (1) hot air solder leveling (HASL LF), (2) electroless nickel immersion gold (ENIG), and (3) organic surface protectant (OSP), organic finish, all on Cu substrates and two types of fluxes (EF2202 and RF800). The results showed that the PCB substrate surface finish has a strong effect on the value of both the wetting time t0 and the contact angle h. The shortest wetting time was noted for the OSP finish (t0 = 0.6 s with EF2202 flux and t0 = 0.98 s with RF800 flux), while the ENIG finish showed the longest wetting time (t0 = 1.36 s with EF2202 flux and t0 = 1.55 s with RF800 flux). The h values calculated from the wetting balance tests were as follows: the lowest h of 45_ was formed on HASL LF (EF2202 flux), the highest h of 63_ was noted on the OSP finish, while on the ENIG finish, it was 58_ (EF2202 flux). After the solderability tests, the interface characterization of cross-sectional samples was performed by means of scanning electron microscopy coupled with energy dispersive spectroscopy.

Foundry Research Institute

Catch Mike Konrad’s Presentation on “The Rush to Clean No-Clean” at the SMTA Capital Chapter Meeting in Laurel, MD

Industry News | 2013-08-09 11:26:31.0

Aqueous Technologies announces that CEO Michael Konrad will present at the upcoming SMTA Capital Chapter meeting.

Aqueous Technologies Corporation

Effect of Thermal Aging on Solderabilityof ENEPIG Surface Finish Used in Printed Circuit Boards

Technical Library | 2021-12-29 19:52:50.0

Medtronic seeks to quantify the thermal aging limits of electroless Ni-electroless Pd-immersion Au (ENEPIG) surface finishes to determine how aggressive the silicon burn-in process can be without loss of solderability. Silicon burn-in (power testing at elevated temperature) is used to eliminate early field failures, critical for device reliability. Thermal aging due to burn-in or annealing causes Ni and Pd diffusion to and oxidation on the surface. Surface oxides limit wetting of the PbSn solder, affecting electrical connectivity of components soldered afterburn-in. Isothermal aging of two ENEPIG surface finishes was performed at 75°C-150°C for 100 hrs-1500hrs to test the thermal aging limits and identify how loss of solderability occurs.

Purdue University

Koh Young Showing PCBA and Semiconductor Inspection Innovations at Productronica on November 14-17, 2023 at Messe München

Industry News | 2023-10-31 18:47:22.0

Koh Young will highlight live demonstrations of its award-winning inspection and measurement solutions for printed circuit board, advanced packaging, and semiconductor assembly at Productronica, the highly-anticipated trade fair in Messe München on November 14-17, 2023 in Munich, Germany. Koh Young will have two booths. The first is at A2.377 and is focused on traditional surface mount technology. Our sister booth at A2.359 is focused on advanced packaging and semiconductor inspection innovations. Join our booth at Productronica 2023 to find out more. The following is just a glimpse into what Koh Young will have in store for our visitors.

Koh Young America, Inc.

Nordson MARCH Research Evaluates the Effects of RF Plasma Processing Prior to Conformal Coating on Adhesion, Conformity of Coverage, and Electrical Functionality

Industry News | 2016-03-03 08:27:28.0

Nordson MARCH has recently released a white paper showing the results of RF plasma processing on conformal coating adhesion, the conformity of the coating coverage, and the resulting effects on electrical functionality of a fully assembled printed circuit board. The research was done in conjunction with Nordson ASYMTEK, AirBorn Electronics, and SMART Microsystems (formerly known as Desich SMART Center). The paper can be downloaded at http://bit.ly/MARCH-PlasmaWP.

MARCH Products | Nordson Electronics Solutions

ALPHA® XL-825 Cored Solder Wire

ALPHA® XL-825 Cored Solder Wire

Videos

ALPHA® Telecore XL-825 lead-free cored solder wire minimizes spattering in hand soldering operations, thus reducing circuit board contamination and enhancing worker safety and comfort.

MacDermid Alpha Electronics Solutions


white residue on wet circuit boards searches for Companies, Equipment, Machines, Suppliers & Information

Count On Tools, Inc.
Count On Tools, Inc.

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Gainesville, GA USA

Phone: (770) 538-0411

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