Industry News | 2011-05-10 19:19:18.0
Kyzen will showcase products for every process at the upcoming SMTA Upper Midwest Expo & Tech Forum, scheduled to take place Thursday, June 9, 2011 at the Sheraton Bloomington Hotel in Bloomington, MN.
Industry News | 2011-08-18 21:09:36.0
Kyzen will showcase products for every process at the upcoming Long Island SMTA Expo and Technical Forum.
Industry News | 2011-11-03 21:32:00.0
Kyzen will showcase products for every process at the upcoming SMTA Austin Expo & Tech Forum
Industry News | 2011-03-11 19:14:35.0
Kyzen will showcase products for every process in Booth #1439 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Industry News | 2011-06-16 14:15:32.0
Kyzen will showcase products for every process at the upcoming Ohio Valley Expo & Tech Forum, scheduled to take place July 14, 2011 at the Doubletree Hotel in Cleveland, OH.
Industry News | 2011-08-15 16:32:05.0
Kyzen will highlight products for every process at the upcoming SMTA Capital Expo & Tech Forum.
New Equipment | Assembly Services
Rest assured in the quality of your production runs with Accu-sembly's IPC-610D certified hand solderers and inspectors, and electrostatic discharge (ESD) protected assembly floor. Our Thru-hole assembly process allows for your parts to be hand prepp
Technical Library | 2022-12-19 18:59:51.0
Material and Process Characterization studies can be used to quantify the harmful effects that might arise from solder flux and other process residues left on external surfaces after soldering. Residues present on an electronic assembly can cause unwanted electrochemical reactions leading to intermittent performance and total failure. Components with terminations that extend underneath the package can trap flux residue. These bottom terminated components are flush with the bottom of the device and can have small solderable terminations located along the perimeter sides of the package. The clearance between power and ground render high electrical forces, which can propagate electrochemical interactions when exposed to atmospheric moisture (harsh environments). The purpose of this research is to predict and understand the functional performance of residues present under single row QFN component packages. The objective of the research study is to develop and collect a set of guidelines for understanding the relationship between ionic contamination and electrical performance of a BTC component when exposed to atmospheric moisture and the trade-offs between electrical, ionic contamination levels, and cleanliness. Utilizing the knowledge gained from undertaking the testing of QFN components and associated DOE, the team will establish a reference Test Suite and Test Spec for cleanliness.
Technical Library | 2011-09-01 18:11:31.0
Scavenging, Site Dressing, Residual Solder Removal. What's in a name? "That which we call an onion, by any other name would smell as strong" (apologies to the immortal bard). And, regardless of the name you give it, the objective is the same, namely the clean up of remaining solder after a component (particularly a BGA) or R.F. Shield has been removed from a PCB. This paper will describe the various methods that are available and discuss their pros and cons.
Industry News | 2011-02-17 14:52:43.0
Kyzen will showcase products for every process at the upcoming SMTA Dallas and Houston Expo & Tech Forums.
