Parts & Supplies | Circuit Board Assembly Products
1). 24 hours lead time. 2). FR-4 Material, Single sided or Double sided. 3). 1 oz copper weight, 1.6mm thick. 4). Green solder mask /white silkscreen 5). 4/4 mil track/space, 0.3mm minimum holes 6). Hot air level finish
Parts & Supplies | Circuit Board Assembly Products
1). FR-4 Material 2). 2 layer, 1.2mm thick 3). 1 oz copper weight. 4). LPI Green solder mask/White silk screen 5). Gold finger 40 microinch, bevelled. 6). HASL + Gold finger, ENIG + gold finger 7). Larg volum, punch contour.
Parts & Supplies | Circuit Board Assembly Products
1). 100*85mm, FR-4 Tg170/ Polyimide 2). 4 layer count rigid/2 layer flex 3). 1.0mm thick rigid/0.15mm thick flex 4). 1 oz each layer 5). Green LPI solder mask/white ident 6). Immersion gold
Parts & Supplies | Circuit Board Assembly Products
1). FR-4 Tg 170 + Rogers 4350B 2). 290*130mm/1up 3). 6 layers at 1.6mm thick 4). Green solder mask/White ident 5). 35um copper finished, ED copper. 6). Electroless gold. 7). Countersunk slots.
Parts & Supplies | Circuit Board Assembly Products
1). 177 x 75mm (2UP), FR-4 Tg 170 2). 1.6mm +/-10%, 6 layer 3). Min. hole 0.15mm, 4/4 track/gap 4). Finished copper weight inner/outer 1 oz 5). Green solder mask/ White ident 6). Immerstion gold. 7). Fine and micro BGA
Parts & Supplies | Circuit Board Assembly Products
1) 190*130mm/10up, FR-4, Tg 135, CTI 175-225V 2) Dielectric constant(Er): 4.4-5.2 3) 2 layers, 1.6mm thick, 1 oz 4) Min. hole size: 0.3mm 5) Min. track/space: 4/4 mils 6) LPI Solder mask/White legend 7) Fiducial mark, tooling strips, mounting holes
Parts & Supplies | Circuit Board Assembly Products
1). 100mm x 98mm/1up, FR-4, 2). 1mm +/-0.1mm，6 Layers 3). 1oz copper finished 3). Green solder mask/white legend 4). Min. hole 0.15mm, 4/4 mil track/gap 5). Blind via layer 1-2, via-in-pad. 6). Immersion gold surface finish
Parts & Supplies | Circuit Board Assembly Products
1). 1+C+1 HDI, buried/blind L1-L5/L5-L8 vias. 2). FR-4 Material, 1 oz weight. 3). 8 layer, 1.6mm thick. 4). 4/4 mils track and space 5). Min.drill 0.1mm 6). Green solder mask/ white silkscreen 7). Immersion gold over nickel
Specification: 8L(1+6+1) Material: FR-4 Board thickness: 1.0mm Final copper: 18um Solder mask color: Green Silkscreen: White Surface Finish: Immersion Gold Profile: Routing and stamp holes E-test: 100% Fixture Quality report: Solder
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