Layer: 2L Base Material:CEM-3 CTI300 Board Thickness: 1.6mm Final copper: 35um Surface Finish: Immersion Tin/Sn Solder mask: Green Silkscreen: white Profile: Routing + v-cut E-test: 100% Fixture Quality report: Solderability test, F
1). 6 oz (210μm) on BOT side. 2). 139.99*110.85mm=1 pcb 3). Base material: FR-4 4). 4 Layer, 1.6mm thick 5). Green solder mask/ white legend 6). Immersion gold. 7). Stack-up ---------- OVERLAY (TOP) ---------- SOLDER MASK (TOP)
1. Aluminum backed 2. Single sided 3. Thermal conductivity: 2.0W/MK 4. White solder mask/ no text 5. 1 OZ copper finished 6. 1.0mm finished thickness 7. Immersion gold 8. Hexagonal shape, punch profile
1. FR-4 material, 1 oz copper finished 2. 6-12 layers, 5mm thick board 3. Green solder mask /white silk screen. 4. Blind/buried vias required. 5. Hot air level Pb free 6. Application: motor, medical equipment, industrial products.
1). 14 different PCB's in one Panel within 400 x 500mm 2). Same material and Thickness. 2). FR-4 Material, Double sided. 3). 1 oz copper weight, 1.6mm thick. 4). Green solder mask /white silkscreen 5). Hot air level finish
New Equipment | Fabrication Services
Flex part 2Layer PCB Polymid PCB thickness: 0.15mm Yellow coverlayer White Silkscreen Surface treatment: ENIG Min Line/space: 6/6mil Min hole: 4mil Rigid part 6Layer PCB PCB thickness: 0.8mm Green solder mask White Silkscreen Surface treatment: ENIG
Quickturn PCB quote please sent E-mail to quotes@huanyupcb.com. ItemCapability Production TypeAlum PCB/Multilayer PCB 1-14L LaminationFR4. CEM-3. Halogen Free PCB ThicknessInner layer: min 0.1mm outer layer: 0.2-3.2mm Copper ThicknessH/
Layer: 1L Base Material:CEM-1 CTI600 Board Thickness: 1.6mm Final copper: 35um Surface Finish: HAL lead free Solder mask: Matt Green Silkscreen: white Profile: Routing + v-cut E-test: 100% Fixture Quality report: Solderability test,
Industry News | 2011-05-19 21:51:24.0
Christopher Associates introduces Onstatic Technology Corp.’s (OTC) R-500 WH White LPI Solder Mask, designed specifically for LED lighting applications.
1). Size: 45*140mm/1 up 2). Layer count: 2 Layer, 20 μm PTH 3). Thickness: 1.6mm +/- 10% 4). Copper weight(Finished): 35 μm 5). SMOBC: LPI Green solder mask/ White legend 6). Holes: 0.4mm minimum, 4/4 mil track/space 7). Pads finish: HASL 8).
