Industry Directory | Manufacturer
A manufacturer of desoldering braid (wick) with an emphasis on continuing advancement in soldering/desoldering technology, visual and x-ray inspection systems, fume extraction, and solder paste inspection systems.
Industry Directory | Manufacturer
Nepes offers flip chip solutions ranging from wafer bumping to advanced packaging and testing for IC manufactures, module electronics and end-product makers.
New Equipment | Rework & Repair Services
BGA Rework Services Offered BGA Remove and Placement Level Three Pad Repair Wire Add Trace Repair BGA Re-Balling BGA Inspection We Rework PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
New Equipment | Rework & Repair Equipment
Desoldering braid (wick) is copper braid used in the rework and repair of printed circuit boards, computers, cell phones, or other electronics. Electronic components are often mounted on a circuit board and careful desoldering of components results i
Electronics Forum | Wed Jan 15 12:10:22 EST 2020 | emeto
Avillaro, I don't have hands on experience with Vapor Phase equipment, but my guess is that it will work better for thick boards like yours. Trying another chemistry is a logical move. May be it is worth trying the fixture for connector flatness as n
Electronics Forum | Wed Jan 15 10:31:55 EST 2020 | emeto
Having 10c thermal differential is a lot. Trying different paste might help - usually thermal expansion makes component detach from PCB, then joint is formed and solidified, then component goes back but is too late to form a joint. Cooling speed migh
Used SMT Equipment | Pick and Place/Feeders
MC389CY-F3-V MC-389 High-Speed, High-Mix Pick & Place WITH CONVEYOR Heavy-duty, welded steel base frame w/ adjustable foot pads High-precision ball screw X-Y drive mechanism w/ linear encoders Three pick and place heads, each with servo-drive
Used SMT Equipment | Pick and Place/Feeders
Heavy-duty, welded steel base frame w/ adjustable foot pads High-precision ball screw X-Y drive mechanism w/ linear encoders Three pick and place heads, each with servo-driven Z- and ?-axis motors Standard on-the-fly vision alignment cameras for c
Industry News | 2023-07-22 11:28:46.0
If need more technical support , pls contact with us at Jenny@ksunsmt.com
Industry News | 2010-07-22 22:37:02.0
IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.
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Parts & Supplies | Pick and Place/Feeders
FUJI W08C feeder parts PP02584 Other Fuji parts: PM03542 PIN wire rope guide PIN (steel) H5265A BOLT, HEX SOCKET hex screw W1039A WASHER, FLAT M2 flat pad PM08CB2 BOLT pinion fixed PIN W10076 WASHER gasket PP02584 PLATE pinion blank PM06AS3 P
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Parts & Supplies | Assembly Accessories
FUJI CP6 3.7mm Nozzle AWPH9572 H1189A PAD S2173A JOINT,ONE-TOUCH A4047A ELBOW Y3026A UNION H1037E VALVE,MANUAL H1006T GENERATOR,VACUUM A4106S XRING A4106T XRING A4067H ELBOW T2063A TUBE T2064A TUBE T4022T TEE W1021A WASHER,LOCK W1022
Technical Library | 2011-06-09 20:28:30.0
QFN Description: A QFN package is a QUAD-FLAT-NO LEAD device. This package is small and lightweight and has no leads (unlike a gull wing or J-leaded device). QFN’s have a thermal pad (paddle) on the bottom side of the part that offers heat dissipation and
Technical Library | 2015-06-11 21:20:29.0
The use of bottom terminated components (BTC) has become widespread, specifically the use of Quad Flat No-lead (QFN) packages. The small outline and low height of this package type, improved electrical and thermal performance relative to older packaging technology, and low cost make the QFN/BTC attractive for many applications.Over the past 15 years, the implementation of the QFN/BTC package has garnered a great amount of attention due to the assembly and inspection process challenges associated with the package. The difference in solder application parameters between the center pad and the perimeter pads complicates stencil design, and must be given special attention to balance the dissimilar requirements
LED panel is a kind of flat panel display which is composed of small LED modules. It is the largest and most widely used large-screen panel technology at present. It can be used not only indoors but also outdoors, waterproof, windproof and rain proo
we have many universal gold plus feeders to sell . www.smt-store.com
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/flat-lead-sizing_topic1171_post4605.html
Flat Lead Sizing - PCB Libraries Forum Forum Home > PCB Footprint Expert > Product Suggestions New Posts FAQ Search Events Register Login Flat Lead Sizing
| https://www.eptac.com/faqs/ask-helena-leo/ask/soldering-wires-to-pads-with-a-lap-joint
. We have some strain gauges on an assembly and need to solder wires to the strain gauge pads. We are concerned that we might not be able to get two wires soldered on flat against the pads as the wire is fairly thick compared to the pad
