Industry News | 2020-05-12 12:57:11.0
BTU International, Inc. is pleased to announce that Fred Dimock, manager of process technology, will participate in a live panel discussion on Tuesday, May 19, 2020. The discussion entitled, "Automation and Energy Conservation in the Reflow Process," will be hosted by Global SMT & Packaging magazine.
Industry News | 2021-07-27 15:49:00.0
BTU International, Inc. today announced plans to exhibit at NEPCON South China, scheduled to take place Aug. 25-27, 2021 at the Shenzhen International Convention & Exhibition Center, booth number 1P45. BTU will showcase the new Valence 3508 selective soldering system and PYRAMAX™ Vacuum Reflow Oven.
Industry News | 2021-07-27 15:48:50.0
BTU International, Inc. today announced plans to exhibit at NEPCON South China, scheduled to take place Aug. 25-27, 2021 at the Shenzhen International Convention & Exhibition Center, booth number 1P45. BTU will showcase the new Valence 3508 selective soldering system and PYRAMAX™ Vacuum Reflow Oven.
Industry News | 2023-07-03 20:07:13.0
Hentec Industries/RPS Automation is pleased to announce its distribution agreement with BTU International, Inc. has been expanded to include the Vector series of selective soldering systems. Under this distribution agreement, BTU is the exclusive distributor of all Hentec/RPS selective soldering systems throughout Asia. BTU will provide sales, service, training, spare parts and support via BTU's extensive sales and service network in Asia.
Industry News | 2024-03-26 13:05:01.0
BTU International, Inc. is proud to announce that its new Aurora platform of reflow ovens is designed to minimize the Cost of Ownership (CoO) while maximizing performance and operational value for its users. With a focus on precision, consistency, and efficiency, the Aurora platform sets a new standard for thermal processing in electronics manufacturing.
Industry News | 2021-11-01 18:00:38.0
Valence 3508 features an electromagnetic solder pump, unmatched thermal capability, rapid programming, and simplistic elegance in operation.
Industry News | 2014-05-07 16:11:10.0
AI Technology (AIT) Releases Electrically and Thermally Conductive 20 Micron Wafer Level Die-Attach Film (DAF), Combines High Glass Transition Temperature and Stress Absorption with Proven Thermal Performance in Die-Attach Power Dissipation.
Industry News | 2009-07-14 17:50:29.0
Carlsbad, CA – July 14th, 2009: Machine Vision Products today announced it would be demonstrating the Ultra 850G Semiconductor, Packaging and MicroElectronics AOI solution at the Semicon West 2009 exhibition at the Moscone Center in San Francisco between 14th and 16th July at booth 743 in the South Hall.
Industry News | 2017-11-08 15:24:31.0
Nordson DIMA, a division of Nordson Corporation (Nasdaq NDSN), will exhibit a range of products at Productronica, the world’s leading trade fair for electronics development and production, to be held in Munich, Germany, on November 14-17, 2017, in Hall A2, stands 345 and 578.
Industry News | 2012-08-02 11:15:11.0
Hesse & Knipps, Inc., (www.hesse-knipps.com) has strengthened its customer support and wedge bonder representation throughout Northwestern United States and Canada with the appointment of Prospect Technical Sales that will now support the company’s family of wedge bonders in Nevada, Oregon, Washington, Montana, Utah, Colorado, Northern California as well as the Canadian provinces of British Columbia and Alberta.
