Technical Library | 2013-12-11 23:24:32.0
Today's analyses of electronics reliability at the system level typically use a "black box approach", with relatively poor understanding of the behaviors and performances of such "black boxes" and how they physically and electrically interact (...) The incorporation of more rigorous and more informative approaches and techniques needs to better understand (...) Understanding the Physics of Failure (PoF) is imperative. It is a formalized and structured approach to Failure Analysis/Forensics Engineering that focuses on total learning and not only fixing a particular current problem (...) In this paper we will present an explanation of various physical models that could be deployed through this method, namely, wire bond failures; thermo-mechanical fatigue; and vibration.
Technical Library | 2019-04-10 22:08:31.0
The stimulating impact of the automotive industry has sharpened focus on immersion tin (i-Sn) more than ever before. Immersion tin with its associated attributes, is well placed to fulfill the requirements of such a demanding application. In an environment dominated by reliability, the automotive market not only has very stringent specifications but also demands thorough qualification protocols. Qualification is ultimately a costly exercise. The good news is that i-Sn is already qualified by many tier one OSATs. The focus of this paper is to generate awareness of the key factors attributed to soldering i-Sn. Immersion tin is not suitable for wire bonding but ultimately suited for multiple soldering applications. The dominant topics of this paper will be IMC formations in relation to reflow cycles and the associated solderability performance. Under contamination free conditions, i-Sn can provide a solderable finish even after multiple reflow cycles. The reflow conditions employed in this paper are typical for lead free soldering environments and the i-Sn thicknesses are approximately 1 μm.
Industry News | 2013-03-07 11:20:46.0
Semikron (SEMIKRON International GmbH) manufactures components and systems for power electronics.
Technical Library | 2013-02-07 17:01:46.0
Silicone contamination is known to have a negative impact on assembly processes such as soldering, adhesive bonding, coating, and wire bonding. In particular, silicone is known to cause de-wetting of materials from surfaces and can result in adhesive failures. There are many sources for silicone contamination with common sources being mold releases or lubricants on manufacturing tools, offgassing during cure of silicone paste adhesives, and residue from pressure sensitive tape. This effort addresses silicone contamination by quantifying adhesive effects under known silicone contaminations. The first step in this effort identified an FT-IR spectroscopic detection limit for surface silicone utilizing the area under the 1263 cm-1 (Si-CH3) absorbance peak as a function of concentration (µg/cm2). The next step was to pre-contaminate surfaces with known concentrations of silicone oil and assess the effects on surface wetting and adhesion. This information will be used to establish guidelines for silicone contamination in different manufacturing areas within Harris Corporation... First published in the 2012 IPC APEX EXPO technical conference proceedings.
Industry Directory | Manufacturer / Research Institute / Laboratory / School
Manufacturer of surface deposition and plasma surface cleaning and etching equipment offering reliable, repeatable cleaning and etching of PCBs and other materials.
Industry Directory | Consultant / Service Provider / Manufacturer
Micro Hybrids offers true solutions for your hybrid micro circuit design, layout, production, testing and quality control needs.
Industry Directory | Consultant / Service Provider
Cadwerx provides superior pcb layout, interactive autorouting, and schematic capture
Industry News | 2014-01-24 16:21:17.0
Hesse Mechatronics has appointed HTMG as the company's sales representative for South America.
Industry News | 2002-07-30 15:53:01.0
July 30, 2002
Henkel’s line of Loctite Hysol® and Loctite Eccobond™ encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. They are developed to provide protection to wire bonds, leads and alumi
