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Inspection Innovations at SEMICON Taiwan 2022

Industry News | 2022-08-14 14:16:58.0

Test Research, Inc. (TRI) will join SEMICON Taiwan held at Taipei Nangang Exhibition Center, Hall 1 – 4F from September 14 - 16, 2022. Visit booth #M1034 to experience the latest in Smart Factory Semiconductor Inspection.

TRI - Test Research, Inc. USA

Advanced Packaging Engineer

Career Center | San Jose, California USA | Engineering,Research and Development

Advanced Packaging Engineer � Develop advanced packaging technologies and processes, including: wafer thinning and dicing; die attach; wire bonding; overmolding; singulation � Perform Design of Experiments to establish optimized process windows for

F-O-R-T-U-N-E Personnel Consultants of Huntsville

Western Region Field Service Engineer

Career Center | San Jose, California USA | Engineering,Technical Support

Attention 2-4 year tech school/engineering graduates with a willingness to learn and travel! We are looking for a field service engineer based in Phoenix, LA or San Jose area that will be responsible for installing, servicing and training customers o

Hesse Mechatronics

Machine Vision Products announced as winner of “Best New Product – USA” category at the Global Technology Award ceremony at SMTAi.

Industry News | 2012-10-16 21:44:41.0

Carlsbad, CA – October 16, 2012: Machine Vision Products (MVP), a leader in Automated Optical Inspection, is proud to announce that their 850G DW metrology based AOI has won the award for Best New Product – USA at the award ceremony held at the SMTA International show in Orlando, Florida. The Global Technology Awards are hosted by Global SMT and Packaging Magazine.

Machine Vision Products, Inc

The XT-3 is a high quality high-resolution manual x-ray inspection system designed to address fast intuitive operation, low volume production capacity, and advanced failure analysis for SMT production inspection and quality control protocols

The XT-3 is a high quality high-resolution manual x-ray inspection system designed to address fast intuitive operation, low volume production capacity, and advanced failure analysis for SMT production inspection and quality control protocols

Videos

Semi-automated, programmable X-ray inspection system with multi-axis for prototyping, failure analysis, manufacturing process validation and rework verification for PCBs up to 18 x 20". The XT-3 is a high quality high-resolution manual x-ray inspecti

MatriX Technologies GmbH

Endicott Interconnect Technologies' Wire Bond Product Launched into Space.

Industry News | 2007-11-08 21:34:39.0

Endicott Interconnect Technologies, Inc. (EI) announced today that its ultra fine pitch wire bond plastic ball grid array (PBGA) substrates and assembled modules have performed perfectly during their first launch into space. They were supplied to Northrop Grumman Corporation (NYST: NOC) for integration into the payload modules on the Orbital Express system.

i3 Electronics

BH Electronics Sdn Bhd

Industry Directory | Manufacturer

A pioneer in the Wire Harness industry in the 1980s,Our Core Production consists of Wire Harness and Cable Assembly,Rubber and Small Plastic Molding, PCB Assembly and Complete Finish Product Box Build

Assembly Resource

Industry Directory | Manufacturer / Manufacturer's Representative

Sales/Marketing, Manufacturers Representatives, Used Equipment Sales

TITAN TIMEPRODUCTS LTD - TTPL

Industry Directory | Manufacturer

TTPL is a reputed EMS(Electronic Manufacturing Service) company offering PCBA, testing and box build on turnkey basis. Certified to ISO/TS16949, TTPL has been offering assembly services at superior quality since 1992.

Nepes Corporation

Industry Directory | Manufacturer

Nepes offers flip chip solutions ranging from wafer bumping to advanced packaging and testing for IC manufactures, module electronics and end-product makers.


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